- 专利标题： Heat transfer cover films
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申请号： US396791申请日： 1995-03-01
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公开(公告)号： US5527759A公开(公告)日： 1996-06-18
- 发明人: Katsuyuki Oshima , Jitsuhiko Ando , Masanori Torii
- 申请人： Katsuyuki Oshima , Jitsuhiko Ando , Masanori Torii
- 申请人地址： JPX
- 专利权人： Dai Nippon Insatsu Kabushiki Kaisha
- 当前专利权人： Dai Nippon Insatsu Kabushiki Kaisha
- 当前专利权人地址： JPX
- 优先权： JPX1-180471 19890714; JPX1-180472 19890714; JPX1-180473 19890714; JPX1-241929 19890920; JPX1-325870 19891218; JPX2-140011 19900531
- 主分类号： B41M5/035
- IPC分类号： B41M5/035 ; B41M5/26 ; B41M5/382 ; B41M5/395 ; B41M5/40 ; B41M5/42 ; B41M5/44 ; B41M5/46 ; B41M5/52 ; B41M7/00 ; B41M5/38
摘要：
The present invention relates to a heat transfer cover film characterized in that a specific transparent resin layer (2) is releasably provided on a substrate film (1). This transparent resin layer (2) can be easily laminated on the surface of the resulting image (7Y, 7M and 7C) by heat transfer means, making it possible to provide expeditious provision of image representations which are improved in terms of such properties as durability, gloss and color development and is curl-free.
公开/授权文献
- US4910575A Semiconductor integrated circuit and its manufacturing method 公开/授权日：1990-03-20
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