摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
A resin composition for an aqueous paint containing different phase structure emulsion particles obtained by multi-stage emulsion polymerization as a binder, wherein the different phase structure emulsion particles have an outermost phase formed by an emulsion polymer of an ethylenic unsaturated monomer, having a glass transition temperature of from null500null C. to 10null C., and satisfy the following conditions (1) to (3): (1) the emulsion polymer forming the outermost phase contains from 1 to 20 mass % of an ethylenic unsaturated monomer having at least one of a polyethylene glycol chain and a polypropylene glycol chain, p1 (2) at least one phase of inner phases from the outermost phase of the different phase structure emulsion particles comprises an emulsion polymer of an ethylenic unsaturated monomer having a glass transition temperature of from 30null C. to 110null C., and (3) the binder has a minimum film-forming temperature of at most 100null C.
摘要:
There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.
摘要:
A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.
摘要:
A case supporting structure has four support pins provided in a disk player, a pair of the support pins having two small size locating pins on upper surfaces of the support pins, and four support seat places formed on the lower shell half. A pair of the support seat places respectively have a circular opening to receive one of the locating pins and an elliptic opening to receive loosely another locating pin. The support seat places on the lower shell half are of small smooth areas to be supported on the support pins.
摘要:
The present invention relates to a heat transfer recording medium in which a substrate has items of information such as an image and characters formed on a surface thereof by heat transfer and a transparent protective layer is provided on at least a part of the surface of the thus recorded information through an adhesive layer, if required, characterized in that the adhesive layer and/or protective layer function to provide security against counterfeiting. Combining information recorded by heat transfer with a function to provide security against counterfeiting, the present invention provides greater security against falsifying or counterfeiting.
摘要:
The present invention relates to a composition for forming an electroconductive pattern excellent in electroconductivity, comprising as main components (a) an alloy powder which is obtained by cooling and finely dividing an eutectic mixture comprising 99.5%-94.5% by weight of nickel and 0.5%-5.5% by weight of boron, (b) a glass frit and (c) an organic vehicle, and a process for forming an electroconductive pattern with the composition.
摘要:
When a temporary adhesive layer for peelable bonding a transfer-recieving material to a thermal transfer sheet comprising a substrate film and a heat-fusible ink layer disposed on one side thereof is caused to comprise a specific adhesive, an excellent composite thermal transfer material is provided. In such a composite thermal transfer sheet, the thermal transfer sheet is firmly bonded to the transfer-recieving material so as not to cause wrinkles or deviation, both of these members may easily be peeled from each other so that the ink layer is exactly transferred to the paper in a transfer region and is not transferred thereto at all in a non-transfer region, whereby the transfer-recieving material is not contaminated. Further, when at least one one end portion of a sheet-type composite thermal transfer sheet is fixed, there is provided a composite thermal transfer sheet wherein unintended peeling is prevented. Further, when an end portion of a co-winding type composite thermal transfer sheet is fixed, there is provided a composite thermal transfer wherein troubles in paperfeeding and printing is prevented. Further, when an end portion of a co-winding type composite thermal transfer sheet is preliminarily fixed to a winding tube, there is provided a composite thermal transfer sheet wherein the used thermal transfer sheet is easy to be handled and no problem occurs in secret-keeping.
摘要:
A heat transfer sheet having a heat transfer layer on one surface of a base sheet, said heat transfer layer being formed of a material containing a dye substantially dissolved in a binder with a weight ratio of the dye to the binder (dye/binder ratio) of 0.3 or more, and said base sheet having a heat-resistant slipping layer provided on the surface on which the heat transfer layer is not provided.A heat transferable sheet to be used in combination with the heat transfer sheet, comprising a receptive sheet having (a) a base sheet and (b) a receptive layer for receiving the dye migrated from the above-mentioned heat transfer sheet on heating, said receptive sheet having an intermediate layer provided between the base sheet and the receptive layer.