发明授权
- 专利标题： Flux composition and corresponding soldering method
- 专利标题（中）： 助焊剂组成及相应的焊接方法
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申请号： US435896申请日： 1995-05-05
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公开(公告)号： US5531838A公开(公告)日： 1996-07-02
- 发明人: Roy L. Arldt , Susan H. Downey , Harry J. Goldlen , Issa S. Mahmoud , Clement A. Okoro , James Spalik
- 申请人： Roy L. Arldt , Susan H. Downey , Harry J. Goldlen , Issa S. Mahmoud , Clement A. Okoro , James Spalik
- 申请人地址： NY Endicott
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Endicott
- 主分类号： B23K35/363
- IPC分类号： B23K35/363 ; B23K35/36 ; C07C55/16 ; H05K3/34 ; B23K35/34
摘要：
A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
公开/授权文献
- US4475455A Tubular stencil unit for screen printing 公开/授权日：1984-10-09
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