公开(公告)号：US5615827A

公开(公告)日：1997-04-01

申请号：US251806

申请日：1994-05-31

申请人： Roy L. Arldt ,  Susan H. Downey ,  Harry J. Golden ,  Issa S. Mahmoud ,  Clement A. Okoro ,  James Spalik

发明人： Roy L. Arldt ,  Susan H. Downey ,  Harry J. Golden ,  Issa S. Mahmoud ,  Clement A. Okoro ,  James Spalik

IPC分类号： B23K35/363 ,  B23K35/36 ,  C07C55/16 ,  H05K3/34 ,  B05D5/12 ,  B23K1/20

CPC分类号： H05K3/3489 ,  B23K35/3612 ,  B23K35/3618 ,  Y10T29/49144

摘要： A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

摘要翻译： 公开了一种新的焊剂组合物，以及用于将电子部件焊接到印刷电路板的相应方法。 新的助焊剂组合物包括庚二酸和两种有机溶剂。 重要的是，新的助焊剂组合物在用于将电子部件安装到印刷电路板上的焊接工艺完成时基本上不留下离子残留物。

公开(公告)号：US5122201A

公开(公告)日：1992-06-16

申请号：US794542

申请日：1991-11-19

申请人： Janice D. Frazier ,  Clement A. Okoro ,  Katherine J. Pearsall ,  Richard A. Reich ,  James R. White

发明人： Janice D. Frazier ,  Clement A. Okoro ,  Katherine J. Pearsall ,  Richard A. Reich ,  James R. White

IPC分类号： B23K35/36

CPC分类号： B23K35/3612

摘要： The composition of the present invention includes a water-soluble soldering flux requiring no thermal energy to place the water-soluble flux in an active state. The water-soluble soldering flux contains (1) from about 1 percent to about 5 percent by weight, based on the weight of the water-soluble soldering flux, of an inorganic acid which, in solution, forms anions of the acid having a low propensity for forming metal complexes; (2) from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of an anionic surfactant; and (3) from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of a diluent. The composition of the present invention may contain a fourth component, a viscosity modifier from about 5 percent to about 40 percent by weight, based on total weight of the water-soluble soldering flux.

公开(公告)号：US5531838A

公开(公告)日：1996-07-02

申请号：US435896

申请日：1995-05-05

申请人： Roy L. Arldt ,  Susan H. Downey ,  Harry J. Goldlen ,  Issa S. Mahmoud ,  Clement A. Okoro ,  James Spalik

发明人： Roy L. Arldt ,  Susan H. Downey ,  Harry J. Goldlen ,  Issa S. Mahmoud ,  Clement A. Okoro ,  James Spalik

IPC分类号： B23K35/363 ,  B23K35/36 ,  C07C55/16 ,  H05K3/34 ,  B23K35/34

CPC分类号： H05K3/3489 ,  B23K35/3612 ,  B23K35/3618 ,  Y10T29/49144

摘要： A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

摘要翻译： 公开了一种新的焊剂组合物，以及用于将电子部件焊接到印刷电路板的相应方法。 新的助焊剂组合物包括庚二酸和两种有机溶剂。 重要的是，新的助焊剂组合物在用于将电子部件安装到印刷电路板上的焊接工艺完成时基本上不留下离子残留物。