发明授权
- 专利标题： Integrated circuit package with an integral heat sink and fan
- 专利标题（中）： 集成电路封装，集成散热器和风扇
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申请号： US429079申请日： 1995-04-26
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公开(公告)号： US5535094A公开(公告)日： 1996-07-09
- 发明人: Daryl J. Nelson , Muralidhar Tirumala , Peter Butler , Gerald A. Budelman
- 申请人： Daryl J. Nelson , Muralidhar Tirumala , Peter Butler , Gerald A. Budelman
- 申请人地址： CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： CA Santa Clara
- 主分类号： G06F1/20
- IPC分类号： G06F1/20 ; H01L23/467 ; H05K7/20
摘要：
A module which has an integral blower that cools an integrated circuit package. The blower is attached to a heat sink that is mounted to the integrated circuit package. Heat generated by the integrated circuit conducts to the heat sink. The blower generates a stream of air that flows across the heat sink and removes heat from the package. The module may have a manifold and duct that direct the airstream across the heat sink.
公开/授权文献
- US4955898A Surgical staple 公开/授权日：1990-09-11
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