发明授权
- 专利标题： Method of preparing a printed circuit board
- 专利标题（中）： 印刷电路板的制备方法
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申请号： US463344申请日： 1995-06-05
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公开(公告)号： US5557844A公开(公告)日： 1996-09-24
- 发明人: Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
- 申请人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H05K1/11 ; H05K3/00 ; H05K3/42 ; H05K3/46 ; H01K3/10
摘要：
Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.
公开/授权文献
- US4464142A Ignition distributor shaft coupler 公开/授权日：1984-08-07
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