发明授权
- 专利标题： Method of manufacturing semiconductor devices
- 专利标题（中）： 制造半导体器件的方法
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申请号： US478447申请日： 1995-06-07
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公开(公告)号： US5561317A公开(公告)日： 1996-10-01
- 发明人: Genzo Momma , Hiroshi Yuzurihara
- 申请人： Genzo Momma , Hiroshi Yuzurihara
- 申请人地址： JPX Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-221000 19900824; JPX2-318071 19901126; JPX3-199274 19910808
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; H01L21/027 ; H01L23/544
摘要：
Disclosed is a method of manufacturing semiconductor devices in which a desired pattern having an area size larger than the field size that can be obtained in one exposure process step of an exposure device is formed. The manufacturing method includes the steps of dividing the desired pattern into a plurality of portions, and conducting exposure on the dividing patterns in a joined fashion.
公开/授权文献
- US4979249A Inflatable pillow having controlled deflation 公开/授权日：1990-12-25
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