Solid-state imaging apparatus
    1.
    发明授权
    Solid-state imaging apparatus 有权
    固态成像装置

    公开(公告)号:US09000343B2

    公开(公告)日:2015-04-07

    申请号:US13807002

    申请日:2011-06-23

    IPC分类号: H01L27/146 H01L31/00

    摘要: The present invention relates to a solid-state imaging apparatus including a first substrate having a plurality of photoelectric conversion units and a second substrate having a plurality of readout circuits. The first substrate is provided with a plurality of first conductive patterns that are electrically separated from one another and the second substrate is provided with a plurality of second conductive patterns that are electrically separated from one another. The first conductive patterns each include a first partial pattern extending in a first direction. The second conductive patterns each include a partial pattern extending in a second direction different from the first direction. The first partial pattern has a length extending in the first direction longer than a length thereof in the second direction.

    摘要翻译: 固态摄像装置技术领域本发明涉及具有多个光电转换单元的第一基板和具有多个读出电路的第二基板的固体摄像装置。 第一基板设置有彼此电分离的多个第一导电图案,并且第二基板设置有彼此电分离的多个第二导电图案。 第一导电图案各自包括沿第一方向延伸的第一部分图案。 第二导电图案各自包括沿与第一方向不同的第二方向延伸的部分图案。 第一部分图案具有在第一方向上比第二方向上的长度长的长度。

    Method of manufacturing semiconductor devices
    9.
    发明授权
    Method of manufacturing semiconductor devices 失效
    制造半导体器件的方法

    公开(公告)号:US5561317A

    公开(公告)日:1996-10-01

    申请号:US478447

    申请日:1995-06-07

    摘要: Disclosed is a method of manufacturing semiconductor devices in which a desired pattern having an area size larger than the field size that can be obtained in one exposure process step of an exposure device is formed. The manufacturing method includes the steps of dividing the desired pattern into a plurality of portions, and conducting exposure on the dividing patterns in a joined fashion.

    摘要翻译: 公开了一种制造半导体器件的方法,其中形成了具有比在曝光装置的一个曝光处理步骤中可获得的场尺寸大的面积尺寸的期望图案。 该制造方法包括以下步骤:将期望的图案分成多个部分,并以连接的方式在分割图案上进行曝光。