发明授权
- 专利标题： Method of cooling a packaged electronic device
- 专利标题（中）： 冷却电子装置的方法
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申请号： US472320申请日： 1995-06-07
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公开(公告)号： US5568683A公开(公告)日： 1996-10-29
- 发明人: Chok J. Chia , Manian Alagaratnam , Qwai H. Low , Seng-Sooi Lim
- 申请人： Chok J. Chia , Manian Alagaratnam , Qwai H. Low , Seng-Sooi Lim
- 申请人地址： CA Milpitas
- 专利权人： LSI Logic Corporation
- 当前专利权人： LSI Logic Corporation
- 当前专利权人地址： CA Milpitas
- 主分类号： F02F7/00
- IPC分类号： F02F7/00 ; H01L23/367 ; H01L23/40 ; H05K3/30
摘要：
A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.
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