发明授权
US5571593A Via fill compositions for direct attach of devices and methods for
applying same
失效
用于直接连接装置的填充组合物和用于施加装置的方法
- 专利标题： Via fill compositions for direct attach of devices and methods for applying same
- 专利标题（中）： 用于直接连接装置的填充组合物和用于施加装置的方法
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申请号： US467558申请日： 1995-06-06
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公开(公告)号： US5571593A公开(公告)日： 1996-11-05
- 发明人: Roy L. Arldt , Christina M. Boyko , Burtran J. Cayson , Richard M. Kozlowski , Joseph D. Kulesza , John M. Lauffer , Philip C. Liu , Voya R. Markovich , Issa S. Mahmoud , James F. Muska , Kostas Papathomas , Joseph G. Sabia , Richard A. Schumacher
- 申请人： Roy L. Arldt , Christina M. Boyko , Burtran J. Cayson , Richard M. Kozlowski , Joseph D. Kulesza , John M. Lauffer , Philip C. Liu , Voya R. Markovich , Issa S. Mahmoud , James F. Muska , Kostas Papathomas , Joseph G. Sabia , Richard A. Schumacher
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： B32B7/04
- IPC分类号： B32B7/04 ; C08G59/40 ; C08G73/00 ; C08L63/00 ; C09D163/00 ; H01B1/20 ; H01B1/22 ; H01B1/24 ; H05K1/09 ; H05K1/11 ; H05K1/16 ; H05K3/00 ; H05K3/40 ; B32B9/00
摘要：
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
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