发明授权
- 专利标题： Method for forming a ceramic circuit substrate
- 专利标题（中）： 形成陶瓷电路基板的方法
-
申请号： US258223申请日： 1994-06-10
-
公开(公告)号： US5575872A公开(公告)日： 1996-11-19
- 发明人: Mineharu Tsukada , Masaharu Hida , Koji Omote
- 申请人： Mineharu Tsukada , Masaharu Hida , Koji Omote
- 申请人地址： JPX Kanagawa
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kanagawa
- 优先权： JPX5-233738 19930920; JPX6-045921 19940316
- 主分类号： B28B1/00
- IPC分类号： B28B1/00 ; B28B7/18 ; B32B37/18 ; B32B38/10 ; H01L21/48 ; H01L23/12 ; H01L23/473 ; H05K1/02 ; B32B31/06 ; B32B31/20 ; B32B31/10
摘要：
A laminated body of a plurality of slit ceramic green sheets 10 with rod-shaped members 11 placed in the spaces defined by the slits 9 is sandwiched by two laminated ceramic green bodies of a plurality of blank ceramic green sheets 8, pressing to make the laminated ceramic green bodies integral with each other, and then after the rod-shaped members 11 are pulled out, the integrated laminated ceramic green bodies are sintered. Thus circular sectional channels 13 with reduced flow resistance for a coolant flowing therethrough are formed inside the ceramic circuit substrate 14. The channels 13 can have low flow resistance and can have high cooling efficiency.
公开/授权文献
- US6145795A Pumpkin stand 公开/授权日：2000-11-14
信息查询
