发明授权
- 专利标题： Polishing apparatus of semiconductor wafer
- 专利标题（中）： 半导体晶片抛光装置
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申请号： US329423申请日： 1994-10-27
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公开(公告)号： US5605488A公开(公告)日： 1997-02-25
- 发明人: Hiroyuki Ohashi , Naoto Miyashita , Ichiro Katakabe , Tetsuya Tsukihara
- 申请人： Hiroyuki Ohashi , Naoto Miyashita , Ichiro Katakabe , Tetsuya Tsukihara
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX5-270654 19931028
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; B24B37/005 ; B24B37/015 ; B24B37/30 ; B24B49/14 ; H01L21/304 ; B24B49/00
摘要：
A plurality of cells are provided in a concave portion of a top plate. A cloth to which water is penetrated is provided in a back face of each cell, and a wafer is attracted by the cloth. First and second pipes are connected to each cell. The first pipe introduces liquid to the cell, and the second pipe discharges liquid from the cell, and guides liquid to the first pipe. A constant-temperature device is provided to each first pipe, and a temperature of liquid of each cell is adjusted by the constant-temperature device in accordance with a temperature distribution of the wafer. Whereby, a polishing rate of each part of the wafer can be equalized.
公开/授权文献
- US4913065A In situ thermal waste disposal system 公开/授权日：1990-04-03
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