发明授权
- 专利标题: Buried layer contact for an integrated circuit structure
- 专利标题(中): 埋层接触用于集成电路结构
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申请号: US496650申请日: 1995-06-29
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公开(公告)号: US5614750A公开(公告)日: 1997-03-25
- 发明人: Joseph P. Ellul , John M. Boyd
- 申请人: Joseph P. Ellul , John M. Boyd
- 申请人地址: CAX Montreal
- 专利权人: Northern Telecom Limited
- 当前专利权人: Northern Telecom Limited
- 当前专利权人地址: CAX Montreal
- 主分类号: H01L21/8249
- IPC分类号: H01L21/8249 ; H01L27/06 ; H01L29/417 ; H01L29/76 ; H01L27/082 ; H01L27/102 ; H01L29/94
摘要:
A buried layer contact for a integrated circuit structure is provided, with particular application for a contact for a buried collector of a bipolar transistor. The buried layer contact takes the form of a sinker comprising a fully recessed trench isolated structure having dielectric lined sidewalls and filled with conductive material, e.g. doped polysilicon which contacts the buried layer. The trench isolated contact is more compact than a conventional diffused sinker structure, and thus beneficially allows for reduced transistor area. Advantageously, a reduced area sinker reduces the parasitic capacitance and power dissipation. In a practical implementation, the structure provides for an annular collector contact structure to reduce collector resistance.
公开/授权文献
- US5011349A Tailgate mounted cargo retaining device 公开/授权日:1991-04-30
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