发明授权
- 专利标题： Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
- 专利标题（中）： 用于从附接到印刷电路板的集成电路封装中去除热的装置
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申请号： US535974申请日： 1995-09-29
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公开(公告)号： US5617294A公开(公告)日： 1997-04-01
- 发明人: Jeff R. Watson , Michael N. Goetsch , Jim V. Noval , Raiyo F. Aspandiar
- 申请人： Jeff R. Watson , Michael N. Goetsch , Jim V. Noval , Raiyo F. Aspandiar
- 申请人地址： CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： CA Santa Clara
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/367 ; H05K1/02 ; H05K3/34 ; H05K7/20
摘要：
An apparatus for removing heat from an integrated circuit package. In one embodiment, the present invention includes a heat slug that is capable of being installed within an opening in a printed circuit board using a standard pick-and-place machine. The surface mountable heat slug includes a top portion and a bottom portion, wherein the bottom portion is formed to fit within the printed circuit board opening. The top portion of the heat slug is attached to the top surface of the printed circuit board. The integrated circuit package is attached to the bottom portion of the heat slug which is exposed along the bottom surface of the printed circuit board.
公开/授权文献
- US5107847A Fiber-optic transducer apparatus 公开/授权日：1992-04-28
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