This invention presents a new anisotropic conductive film for conductive connections, its method of manufacture, and connectors which use the same, which reduces the connection resistance of semiconductor and similar devices, to the circuit substrates, and simultaneously simplifies the repair. Copper foil 2 is bonded on both sides to an electrical insulating film 3. Holes are formed in the copper foil 2 by etching, and through-holes 5 are formed in the aforesaid electrical insulating film 3, using copper foil 2 as a mask for etching. Next, the through-holes 5 are filled with a conductive elastomer 6, and hardened. The copper foil 2 is then etched to form protuberances 4 of elastomer 6 having the same viscosity. The conducting elastomer 6 protuberance 4 on one side makes contact with the semiconductor device pad, while the protuberance 4 on the other side makes contact with the substrate-side pad. A conductive connection is made by pressing both together.