- 专利标题: Hard-carbon-film-coated substrate and apparatus for forming the same
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申请号: US464544申请日: 1995-06-05
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公开(公告)号: US5629086A公开(公告)日: 1997-05-13
- 发明人: Hitoshi Hirano , Keiichi Kuramoto , Yoichi Domoto , Seiichi Kiyama
- 申请人: Hitoshi Hirano , Keiichi Kuramoto , Yoichi Domoto , Seiichi Kiyama
- 申请人地址: JPX Moriguchi
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JPX Moriguchi
- 优先权: JPX5-167866 19930707; JPX5-188084 19930729; JPX5-207912 19930823
- 主分类号: C23C14/00
- IPC分类号: C23C14/00 ; C23C16/02 ; C23C16/26 ; C23C16/458 ; C23C16/511 ; H01J37/32 ; C04B41/85
摘要:
A hard-carbon-film-coated substrate includes in stacked sequence a substrate, an intermediate layer, and a hard carbon film. The substrate consists of a metal or an alloy mainly composed of Ni or Al, or stainless steel. The intermediate layer is mainly composed of Ru, Si, Ge or carbon, or is a mixed layer including Ru, Si, or Ge mixed with at least one of carbon, nitrogen or oxygen, with a composition gradient across its thickness. An apparatus for forming the coated substrate especially includes means for forming the intermediate layer and means for forming the hard carbon film in the same vacuum chamber.
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