发明授权
- 专利标题： Surface treated structure for solder joint
- 专利标题（中）： 焊接表面处理结构
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申请号： US284684申请日： 1994-08-09
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公开(公告)号： US5635764A公开(公告)日： 1997-06-03
- 发明人: Hisayoshi Fujikawa , Takeshi Ohwaki , Yasunori Taga , Osamu Takenaka , Kenji Kondo , Takao Yoneyama , Ichiharu Kondo
- 申请人： Hisayoshi Fujikawa , Takeshi Ohwaki , Yasunori Taga , Osamu Takenaka , Kenji Kondo , Takao Yoneyama , Ichiharu Kondo
- 申请人地址： JPX Kariya
- 专利权人： Nippondenso Co., Ltd.
- 当前专利权人： Nippondenso Co., Ltd.
- 当前专利权人地址： JPX Kariya
- 优先权： JPX4-330343 19921210
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/482 ; H01L23/492 ; H01L23/495 ; H01L23/48
摘要：
On a rear surface of a semiconductor (10), a contact layer (11), a diffusion preventing layer (12) and a solder joint layer (13) are formed, and this solder joint layer (13) is connected to a mount base (15) by a Pb-Sn solder layer (14). The contact layer (11) is formed of a rare earth metal, its silicide or a composite thereof, the diffusion preventing layer (12) is formed of a ferrous metal, and the solder joint layer (13) is formed of a Ni-Au alloy. By forming the diffusion preventing layer (12) using the ferrous metal, a diffusion of tin in a solder is prevented and by the solder joint layer (13) of the Ni-Au alloy, an excellent solder joint property can be maintained to reduce the number of laminated layers. Further, as a surface treated layer of at least one joint member, the Ni-Au alloy is used and by heating the semiconductor substrate via a solder foil in a reducing atmosphere a high airtightness is obtained.
公开/授权文献
- US5040019A Copying apparatus having automatic document feeder & sorter 公开/授权日：1991-08-13
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