摘要:
On a rear surface of a semiconductor (10), a contact layer (11), a diffusion preventing layer (12) and a solder joint layer (13) are formed, and this solder joint layer (13) is connected to a mount base (15) by a Pb-Sn solder layer (14). The contact layer (11) is formed of a rare earth metal, its silicide or a composite thereof, the diffusion preventing layer (12) is formed of a ferrous metal, and the solder joint layer (13) is formed of a Ni-Au alloy. By forming the diffusion preventing layer (12) using the ferrous metal, a diffusion of tin in a solder is prevented and by the solder joint layer (13) of the Ni-Au alloy, an excellent solder joint property can be maintained to reduce the number of laminated layers. Further, as a surface treated layer of at least one joint member, the Ni-Au alloy is used and by heating the semiconductor substrate via a solder foil in a reducing atmosphere a high airtightness is obtained.
摘要:
Disclosed is a nickel layer formed on a substrate by sputtering, in which nickel layer a percent ratio of an X-ray diffraction peak intensity of the (200) plane of the nickel layer to that of the (111) plane of the nickel layer is not less than 10%. This nickel layer has a reduced stress, and therefore, lessens a bending of a substrate. The nickel layer is formed by a process for sputtering nickel on a substrate, comprising supplying an argon gas into a vacuum chamber, adjusting a pressure of the argon gas in the vacuum chamber to a predetermined value, ionizing the argon gas, bombarding a target containing nickel with the ionized argon gas, to sputter nickel atoms, and depositing the sputtered nickel atoms onto the substrate, wherein the predetermined pressure of the argon gas is not lower than 12 mTorr.
摘要:
A method for forming electrodes with strong adhesion strength for a semiconductor device is provided. The adhesion strength between a Si substrate and a Ti film is made higher than the pulling stress of a Ni film. Before an electrode is formed using sputtering process, the natural oxide film grown on a semiconductor substrate is removed using an Ar reverse sputtering while the top surface of the silicon substrate is converted to an amorphous through a bombardment and introduction of Ar. While Ti is deposited, a Si-Ti amorphous layer is formed in the Si/Ti interface. In this case, the amount of Ar atoms is controlled less than 4.0.times.10.sup.14 atoms/cm.sup.2. The Ar amount also can be controlled by adjusting the conditions such as the output or cathodic voltage of Ar reverse sputtering and decreasing the absolute value of Ar in the amorphous Si layer. Also the Ar amount can be controlled by diffusing Ar atoms into the substrate at more than about 300.degree. C. during Ti film deposition to diverse the Ar distribution. As a result argon atoms which concentrates at the interface do not affect with respect to the Si-Ti amorphous layer, whereby the bonding strength of the amorphous layer is maintained. Therefore, the strong adhesion strength between Si and Ti can provide a sufficient durability against the film stress of the Ni film.
摘要:
A method and apparatus for detecting metal wipe damages of plane bearings with the metal wipe generating an ultrasonic signal as an acoustic emission signal when it occurs. The ultrasonic signal has a periodic appearance therefore, the metal wipe damages, can be detected by monitoring the periodic nature of the ultrasonic signal. The ultrasonic signal is received by a transducer fixed to the plane bearing with the periodic nature of the received ultrasonic signal being computed by a processing unit so as to provide a output signal of the occurrence of a metal wipe when the received ultrasonic signal is periodic.
摘要:
Disclosed is a rotating machinery diagnosis system with an AE technique, which comprises: an AE sensor mounted on a rotary machine for sensing an acoustic signal of the rotary machine; envelope detector means for obtaining an envelope signal from the acoustic signal from the AE sensor; waveform-feature processor means for performing signal processing so as to detect a feature of waveform of an output waveform signal from the envelope detector means; feature decision means for judging whether the feature of waveform belongs to a continuous type or a burst type and/or to a rotation-synchronous type or a rotation-asynchronous type on the basis of an output signal from the waveform-feature processor means; and diagnostic output means for outputting and displaying an output signal from the feature decision means, whereby it is possible to perform judgement simultaneously as to a plurality of kinds of abnormality.
摘要:
A tablet type coordinate input apparatus comprises a flat medium for propagating a longitudinal elastic wave, longitudinal elastic wave detecting elements disposed on part of the end-adjacent side surfaces or of the front surface of the flat medium, a longitudinal elastic wave input member having an end portion terminating in a sharp-pointed end and brought into pressure engagement at that end with any desired position on the surface of the flat medium to radiate the longitudinal elastic wave from that end, an amplifier circuit amplifying electrical signals indicative of the elastic wave detected by the detecting elements, a comparator circuit comparing the signals amplified by the amplifier circuit with a predetermined threshold voltage thereby generating delay pulse signals corresponding to the propagation times of the longitudinal elastic wave, a counter circuit counting the lengths of time elapsed from the time of radiation of the longitudinal elastic wave toward the flat medium as a result of pressure engagement of the input member therewith to the time of generation of the delay pulse signals, and a computing circuit computing the coordinates on the basis of the time signals applied from the counter circuit.
摘要:
Several embodiments of prime mover driven electrical generators wherein the power output is increased without increasing the driving speed by driving both of the generator elements in opposite directions.
摘要:
A corrosion resisting copper alloy, especially suitable for use in fabricating heat exchangers, comprises 25 to 38% by weight zinc, 0.005 to 0.04% by weight phosphorus, the remainder of the alloy being copper, the alloy having a recrystallized grain size within the range of 2.mu. to 10.mu..
摘要:
A method and apparatus for detecting the occurrence of rubbing in a rotary machine, in which at least one acoustic sensor is mounted on at least the rotor part or the stator part of the rotary machine, and the output signal from the acoustic sensor is detected and then filtered to extract a frequency component having a frequency substantially equal to the rotational frequency of the rotary machine, so as to detect the occurrence of rubbing in the rotary machine as early as possible and also to locate the source of the rubbing. Even when the occurrence of abnormal metal-to-metal contact at a bearing of the rotary machine is detected, it is discriminated from rubbing so that the occurrence of the rubbing can be reliably detected.
摘要:
A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a distal end surface of each opposed secondary bump on one side of the semiconductor device. An area of the contact surface is larger than that of the opposed distal end surface. By this method, damage to the substrate from the ultrasonic can be reduced without using a reinforcing layer.