发明授权
US5639013A Optimally shaped solder joints for improved reliability and space savings
失效
最佳形状的焊点，可提高可靠性和节省空间
- 专利标题： Optimally shaped solder joints for improved reliability and space savings
- 专利标题（中）： 最佳形状的焊点，可提高可靠性和节省空间
-
申请号： US363768申请日： 1994-12-23
-
公开(公告)号： US5639013A公开(公告)日： 1997-06-17
- 发明人: Vivek Amir Jairazbhoy , Richard Keith McMillan, II
- 申请人： Vivek Amir Jairazbhoy , Richard Keith McMillan, II
- 申请人地址： MI Dearborn
- 专利权人： Ford Motor Company
- 当前专利权人： Ford Motor Company
- 当前专利权人地址： MI Dearborn
- 主分类号： H05K3/34
- IPC分类号： H05K3/34
摘要：
A method for improving the reliability of solder joints is disclosed for use in reflow soldering. In the method, a predetermined amount of solder is applied to at least two solder pads on a circuit board and a component having at least two terminals is fixed in relation to the solder pads. The solder is melted so that the component floats to a predetermined height above the solder pads and, when solidified, the solder fillet formed at each terminal holds the component a predetermined height above the circuit board and forms a convex shape.
公开/授权文献
- US4983919A Frequency response detection apparatus 公开/授权日：1991-01-08