公开(公告)号：US5663529A

公开(公告)日：1997-09-02

申请号：US528369

申请日：1995-09-14

申请人： Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy

发明人： Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K1/0209 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144

摘要： A footprint, and method for forming the footprint, of the type for mounting a surface mount component having a heatsink which defines a first registration edge thereon. The substrate pad is positioned on the substrate for registrated engagement with the heatsink. The substrate pad has an area substantially larger than the area of the heatsink to improve the dissipation of thermal energy. The substrate pad includes notches for defining registration edges which are juxtaposed with corresponding registration edges on the heatsink when the electronic component is in proper alignment with the substrate pad. Surface tension forces produced by melting solder interposed between the heatsink and the substrate pad act upon the registration edges to maintain proper alignment of the component with the substrate pad.

摘要翻译： 用于形成用于安装具有限定其上的第一对准边缘的散热器的表面安装部件的类型的覆盖区和方法。 衬底垫定位在衬底上以与散热器配准接合。 衬底焊盘的面积明显大于散热器的面积，以改善热能耗散。 衬底焊盘包括用于定义配准边缘的凹口，当电子部件与衬底焊盘正确对准时，它们与散热器上的对应配准边缘并置。 通过熔化置于散热器和基板焊盘之间的焊料产生的表面张力作用在对准边缘上，以保持部件与基板焊盘的适当对准。

公开(公告)号：US06303872B1

公开(公告)日：2001-10-16

申请号：US08882482

申请日：1997-06-25

申请人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II

发明人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II

IPC分类号： H01R909

CPC分类号： H05K3/3442 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16105 ,  H01L2224/16238 ,  H01L2924/384 ,  H05K2201/10636 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit assembly having anti-tombstoning solder joints, including: a substrate 10 having at least one mounting pad 20 thereon; an SMD 30 having at least one termination 40; and at least one solder joint 50 connecting each termination 40 to its respective mounting pad 20. Each solder joint 50 is convex in shape, having a continuous and substantially circular arcuate outer profile 60 and covering substantially all of the mounting pad 20 and substantially all of a top portion 42 of each termination 40. Each mounting pad 20 has a predetermined length lp and each solder joint has a predetermined volume of solder selected such that a positive net anti-tombstoning moment is exerted upon the SMD 30 when at least one solder joint 50 is in a molten state.

摘要翻译： 一种具有防抱死焊点的电子电路组件，包括：衬底10，其上具有至少一个安装垫20; 具有至少一个终端40的SMD 30; 以及至少一个将每个终端40连接到其相应的安装垫20的焊接接头50.每个焊接接头50的形状是凸的，具有连续且大致圆弧形的外轮廓60，并且基本上覆盖所有的安装垫20， 每个端子40的顶部42.每个安装垫20具有预定的长度lp，并且每个焊点具有预定体积的焊料选择，使得当至少一个焊点 50处于熔融状态。

公开(公告)号：US5931371A

公开(公告)日：1999-08-03

申请号：US784333

申请日：1997-01-16

申请人： Yi-Hsin Pao ,  Chan-Jiun Jih ,  Jun Ming Hu ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Xu Song

发明人： Yi-Hsin Pao ,  Chan-Jiun Jih ,  Jun Ming Hu ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Xu Song

IPC分类号： B23K35/02 ,  H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  B23K31/02 ,  B23K35/14 ,  B23K35/24

CPC分类号： H01L24/81 ,  B23K35/0244 ,  H05K3/3421 ,  H05K3/3442 ,  H01L2224/13111 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K3/305 ,  Y02P70/611 ,  Y02P70/613

摘要： A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.

摘要翻译： 用于将部件接合到基板的方法将基底焊接部分施加到基板，并在基底焊接部分中提供支撑焊接部分。 隔离焊料部分具有比基底焊料部分更高的熔化温度和基本上对应于部件和基板之间期望的间隔高度的高度。 该部件位于支座焊接部分上，并且基底焊料部分在回流条件下熔化以在部件和基板之间形成焊接接头。 该接头基本上封装了支座焊接部分，其中回流条件在基底焊料部分和支座焊接部分之间产生树枝状结构。

公开(公告)号：US5936846A

公开(公告)日：1999-08-10

申请号：US786389

申请日：1997-01-16

申请人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Yi-Hsin Pao

发明人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Yi-Hsin Pao

IPC分类号： H05K1/18 ,  H05K3/34 ,  H05K1/14 ,  H05K1/16

CPC分类号： H05K3/3442 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/611 ,  Y02P70/613

摘要： There is disclosed herein a surface mount printed circuit board having a substrate, at least one surface mount device, at least two mounting pads per device, solder joints connecting the terminations of the device to their respective mounting pads, at least one rectangular lifter pad on the substrate amid the mounting pads, and a solder mass on each lifter pad in contact with the bottom surface of the device. The inner and outer extensions of the mounting pads, the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads are designed such that the solder joint has preferably convex outer fillets, the device is maintained at a predetermined height above the mounting pads, the inner fillet angle is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased. An alternate embodiment also includes plugged vias under the lifter pads and/or mounting pads, with gas pockets trapped between the solder masses/solder joints and the plugged vias. This trapped gas pocket provides additional buoyant force upon the SMD during reflow.

摘要翻译： 这里公开了一种表面贴装印刷电路板，其具有衬底，至少一个表面贴装器件，每个器件至少两个安装焊盘，将器件的端子连接到其相应的安装焊盘的焊点，至少一个矩形升降器垫 在安装焊盘之间的衬底，以及每个升降器衬垫上与接触器件的底表面的焊料质量。 安装垫的内部和外部延伸部分，升降器垫的尺寸，数量和形状以及沉积在安装和升降器垫上的焊料的量被设计成使得焊接接头具有优选的凸形外圆角，该装置是 保持在安装焊盘上方的预定高度处，内圆角保持在预定的最小角度以上以增加焊点裂纹的起始时间，并且总的焊点裂纹扩展长度增加。 替代实施例还包括在升降器垫和/或安装垫之下的插入通孔，其中气囊被捕获在焊料块/焊接接头和堵塞的通孔之间。 这种被捕获的气体袋在回流焊时在SMD上提供额外的浮力。

公开(公告)号：US5842275A

公开(公告)日：1998-12-01

申请号：US524097

申请日：1995-09-05

申请人： Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy ,  Robert Joseph Gordon ,  George Albert Garfinkel

发明人： Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy ,  Robert Joseph Gordon ,  George Albert Garfinkel

IPC分类号： H01L21/60 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42

CPC分类号： H01L24/81 ,  H05K1/0206 ,  H05K1/113 ,  H05K3/341 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0272 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/0959 ,  H05K2201/10166 ,  H05K2201/10651 ,  H05K2201/10969 ,  H05K2203/0455 ,  H05K2203/1178 ,  H05K3/0061 ,  H05K3/0094 ,  H05K3/42 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

摘要： Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.

摘要翻译： 将电子部件表面安装在其上承载有平面印刷电路的支撑绝缘板的一侧上的接合焊盘的方法，该焊盘通过使用经受一个或多个气体捕获的焊料材料连接到板上的一个或多个导体 通孔通孔，包括：（a）在印刷电路的顶面下方形成至少一个通气通道，并且从位于或接近其中一个通孔的位置延伸到基本上接近焊料材料周边的位置， 放在其上 （b）在部件和焊盘之间种植焊料的沉积物; （c）使部件，焊料和焊盘一起形成组件; 和（d）加热组件以将焊料材料短暂地回流到位，而不会移动，倾斜或倾斜组件，允许所述一个通孔中的任何被捕获的空气膨胀并通过通道迁移至至少外围 垫。

公开(公告)号：US5639013A

公开(公告)日：1997-06-17

申请号：US363768

申请日：1994-12-23

申请人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II

发明人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II

IPC分类号： H05K3/34

CPC分类号： H05K3/3442 ,  H05K2201/09427 ,  H05K2201/10636 ,  H05K2201/2081 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

摘要： A method for improving the reliability of solder joints is disclosed for use in reflow soldering. In the method, a predetermined amount of solder is applied to at least two solder pads on a circuit board and a component having at least two terminals is fixed in relation to the solder pads. The solder is melted so that the component floats to a predetermined height above the solder pads and, when solidified, the solder fillet formed at each terminal holds the component a predetermined height above the circuit board and forms a convex shape.

摘要翻译： 公开了一种用于提高焊点可靠性的方法，用于回流焊接。 在该方法中，将预定量的焊料施加到电路板上的至少两个焊盘，并且具有至少两个端子的部件相对于焊盘固定。 焊料熔化，使得部件浮动到焊盘上方的预定高度，并且当固化时，形成在每个端子处的焊接圆角将部件保持在电路板上方的预定高度并形成凸形。

公开(公告)号：US5917704A

公开(公告)日：1999-06-29

申请号：US944700

申请日：1997-10-06

申请人： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

发明人： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

IPC分类号： H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34 ,  H05K7/20

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H05K3/341 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/0112 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/107 ,  H05K3/3452 ,  H05K3/3494 ,  Y02P70/613

摘要： There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

摘要翻译： 这里公开了一种具有整体散热器16的电子部件10，其特别设计用于辅助将散热器激光焊接到衬底20上的焊盘22上。部件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大体上垂直于顶表面和底表面之间。 部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端接件14的一部分。散热器16限定电子部件10的至少一部分底表面32，并且至少 电子部件10的至少一个周边外表面34的一部分。

公开(公告)号：US5878487A

公开(公告)日：1999-03-09

申请号：US718166

申请日：1996-09-19

申请人： Richard Keith McMillan, II ,  Andrew Zachary Glovatsky ,  Michael George Todd

发明人： Richard Keith McMillan, II ,  Andrew Zachary Glovatsky ,  Michael George Todd

IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K1/0245 ,  H05K1/0224 ,  H05K1/0228 ,  H05K3/107 ,  H05K3/428 ,  H05K3/4685 ,  H05K1/0253 ,  H05K2201/0376 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09681 ,  H05K2201/097 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of supporting an electrical circuit on an electrically insulative base substrate comprises embossing a first circuit pattern on the substrate, and plating or etching a second circuit pattern over the first circuit pattern such that the first and second circuit patterns are in physical contact with each other for electrical communication therebetween. Plated through-holes are provided for facilitating support of a twisted pair of electrical conductors on a base substrate.

摘要翻译： 一种在电绝缘基底基板上支撑电路的方法包括在衬底上压印第一电路图案，以及在第一电路图案上电镀或蚀刻第二电路图案，使得第一和第二电路图案与每个电路图案物理接触 另一个用于其间的电气通信。 提供镀通孔以便于支撑基底基板上的双绞电导体。

公开(公告)号：US5979043A

公开(公告)日：1999-11-09

申请号：US892463

申请日：1997-07-14

申请人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

发明人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

IPC分类号： B29C45/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4635 ,  B29C45/14467 ,  B29C45/14778 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/462 ,  B29K2995/0005 ,  B29L2031/3493 ,  H05K1/0393 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/1327 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158

摘要： A method of manufacturing an electronic circuit assembly that includes a number of electrically interconnected flexible films, each flexible film having a flexible electrical wiring circuit. The electrical wiring circuits are interconnected between film layers and the film layers are adhered to a molded backing structure. A first flexible film is formed with a pattern of flexible electrical wiring circuits created on at least one surface thereof. The first flexible film has a passage that provides an electrical connection through the flexible film. A second flexible film is formed with a pattern of flexible electrical wiring circuits created on a least one surface thereof. The second flexible film has an electrical interconnect feature that connects with the electrical passage on the first film and electrically connects the first film with the second film. The first flexible film is overlaid juxtaposed the second flexible film so that the passage is aligned adjacent the electrical interconnect feature. The first and second flexible films are placed within an open mold. The mold is closed and a plastic material is injected within the mold adjacent at least one surface of the first and second flexible films. The molten plastic adheres to the first and second flexible films and forms an integral backing structure. The backing structure and first and second flexible films together form the circuit assembly.

摘要翻译： 一种制造包括多个电互连柔性膜的电子电路组件的方法，每个柔性膜具有柔性电布线电路。 电气布线电路在膜层之间相互连接，并且膜层粘附到模制背衬结构上。 第一柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第一柔性膜具有通过柔性膜提供电连接的通路。 第二柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第二柔性膜具有与第一膜上的电通路连接并将第一膜与第二膜电连接的电互连特征。 第一柔性膜叠置在第二柔性膜上，使得通道对准邻近电互连特征。 第一和第二柔性膜被放置在开放模具内。 模具关闭，并且塑料材料在模具内相邻于第一和第二柔性膜的至少一个表面注入。 熔融的塑料粘附到第一和第二柔性膜上并形成整体的背衬结构。 背衬结构和第一和第二柔性膜一起形成电路组件。

公开(公告)号：US5929375A

公开(公告)日：1999-07-27

申请号：US644100

申请日：1996-05-10

申请人： Andrew Zachary Glovatsky ,  Michael George Todd ,  Richard Keith McMillan, II

发明人： Andrew Zachary Glovatsky ,  Michael George Todd ,  Richard Keith McMillan, II

IPC分类号： H05K1/02 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K9/00

CPC分类号： H05K1/0207 ,  H05K1/0224 ,  H05K3/4092 ,  H05K3/4641 ,  H05K1/0206 ,  H05K1/0253 ,  H05K2201/0323 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/10689 ,  H05K3/429

摘要： A circuit board includes a substantially non-conductive substrate and first and second rigid sheets. The first sheet forms a grid pattern substantially encapsulated by the substrate, and a portion of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet is also substantially encapsulated by the substrate and has a portion which extends beyond the boundary of the substrate to form a second interconnection terminal. The second sheet acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate.

摘要翻译： 电路板包括基本不导电的基底和第一和第二刚性片。 第一片形成基本上由衬底封装的栅格图案，并且第一片的一部分延伸超过衬底的边界以形成第一互连端。 第二片材也基本上被基底封装，并且具有延伸超过衬底的边界以形成第二互连端子的部分。 第二片作为电磁干扰屏蔽，并且还具有小于衬底的热膨胀系数的热膨胀系数。