发明授权
- 专利标题： Composite plating method
- 专利标题（中）： 复合电镀法
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申请号： US539904申请日： 1995-10-06
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公开(公告)号： US5651872A公开(公告)日： 1997-07-29
- 发明人: Hiromitsu Takeuchi , Yoshiki Tsunekawa , Masahiro Okumiya
- 申请人： Hiromitsu Takeuchi , Yoshiki Tsunekawa , Masahiro Okumiya
- 申请人地址： JPX Aichi-ken
- 专利权人： Toyoda Gosei Co., Ltd.
- 当前专利权人： Toyoda Gosei Co., Ltd.
- 当前专利权人地址： JPX Aichi-ken
- 优先权： JPX6-244393 19941007
- 主分类号： C23C18/52
- IPC分类号： C23C18/52 ; C23C24/04 ; C25D5/08 ; C25D5/44 ; C25D15/02 ; C25D15/00 ; B05D1/36 ; C25D5/00
摘要：
A composite plating film is prepared from a composite plating solution containing a metal matrix and insoluble particles 4 dispersed therein or deposited therewith. The composite plating film has a non-uniform concentration of insoluble particles along a direction of the thickness of the composite film. The non-uniform concentration is achieved by changing the discharge rate of composite plating solution during deposition of the film on the base material.
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