发明授权
US5654208A Method for producing a semiconductor device having a semiconductor layer of SiC comprising a masking step 失效
用于制造具有包括掩模步骤的SiC的半导体层的半导体器件的方法

Method for producing a semiconductor device having a semiconductor layer
of SiC comprising a masking step
摘要:
The present invention relates to a method for producing a semiconductor device having a semiconductor layer of SiC. The method comprises the steps of a) applying a mask on at least a portion of the SiC layer to coat a first portion of the SiC layer leaving a second portion thereof uncoated, b) applying a heat treatment to the SiC layer, and c) supplying dopants to the SiC layer during the heat treatment for diffusion of the dopants into the SiC layer at the second portion thereof for doping the SiC layer. The mask is made of crystalline AIN as the only component or AIN as a major component of a crystalline alloy constituting the material.
公开/授权文献
信息查询
0/0