发明授权
US5654583A Semiconductor device having first and second semiconductor structures
directly bonded to each other
失效
具有彼此直接接合的第一和第二半导体结构的半导体器件
- 专利标题： Semiconductor device having first and second semiconductor structures directly bonded to each other
- 专利标题（中）： 具有彼此直接接合的第一和第二半导体结构的半导体器件
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申请号： US494228申请日： 1995-06-23
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公开(公告)号： US5654583A公开(公告)日： 1997-08-05
- 发明人: Yae Okuno , Kazuhisa Uomi , Masahiro Aoki , Misuzu Sagawa
- 申请人： Yae Okuno , Kazuhisa Uomi , Masahiro Aoki , Misuzu Sagawa
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-142862 19940624
- 主分类号： H01S5/02
- IPC分类号： H01S5/02 ; H01L29/22 ; H01L29/04 ; H01L29/20
摘要：
The semiconductor device has a semiconductor structure directly bonded onto another semiconductor structure of a different kind from the former. These two semiconductor structures are arranged in such a way that their crystal structures in a cross section perpendicular to the bonded interface of the two semiconductor structures are different from each other or that their lattice orders are not equivalent. This can be applied to direct bonding of any combination of semiconductor structures in any crystallographic orientation relation. This also allows bonding of three or more kinds of semiconductor structures.
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