发明授权
- 专利标题: Process for forming a polysilicon electrode in a trench
- 专利标题(中): 在沟槽中形成多晶硅电极的工艺
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申请号: US391904申请日: 1995-02-21
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公开(公告)号: US5656544A公开(公告)日: 1997-08-12
- 发明人: Albert Stephan Bergendahl , Claude Louis Bertin , John Edward Cronin , Howard Leo Kalter , Donald McAlpine Kenney , Chung Hon Lam , Hsing-San Lee
- 申请人: Albert Stephan Bergendahl , Claude Louis Bertin , John Edward Cronin , Howard Leo Kalter , Donald McAlpine Kenney , Chung Hon Lam , Hsing-San Lee
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: H01L27/10
- IPC分类号: H01L27/10 ; H01L21/8239 ; H01L21/8242 ; H01L21/8247 ; H01L27/105 ; H01L27/108 ; H01L27/115 ; H01L29/788 ; H01L29/792 ; H01L21/44 ; H01L21/48
摘要:
A semiconductor device memory array formed on a semiconductor substrate comprising a multiplicity of field effect transistor DRAM devices disposed in array is disclosed. Each of the DRAM devices is paired with a non-volatile EEPROM cell and the EEPROM cells are disposed in a shallow trench in the semiconductor substrate running between the DRAM devices such that each DRAM-EEPROM pair shares a common drain diffusion. The EEPROM cells are arranged in the trench such that there are discontinuous laterally disposed floating gate polysilicon electrodes and continuous horizontally disposed program and recall gate polysilicon electrodes. The floating gate is separated from the program and recall gates by a silicon rich nitride. The array of the invention provides high density shadow RAMs. Also disclosed are methods for the fabrication of devices of the invention.
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