发明授权
- 专利标题： Ceramic circuit board
- 专利标题（中）： 陶瓷电路板
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申请号： US365483申请日： 1994-12-28
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公开(公告)号： US5672848A公开(公告)日： 1997-09-30
- 发明人: Hiroshi Komorita , Tadashi Tanaka , Takayuki Naba , Takashi Hino
- 申请人： Hiroshi Komorita , Tadashi Tanaka , Takayuki Naba , Takashi Hino
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX5-336723 19931228
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/52 ; H01L23/13 ; H01L23/373 ; H01L23/00
摘要：
A ceramic circuit board wherein a copper circuit plate is directly bonded at a predetermined position on a ceramic substrate and heat is applied; or the copper circuit plate is integrally bonded through a brazing material containing an active metal, such as Ti, Zr and Hf; and a semiconductor element is bonded onto a semiconductor element mounting portion of the copper circuit plate through a solder layer. The copper plate element is formed with grooves or holes thereon and is bonded on the semiconductor element mounting portion of the copper circuit plate, and the semiconductor element is integrally bonded onto a surface of a grooved or holed side of the copper plate element through a solder layer. By the above structure, the ceramic circuit board prevents solder voids when soldering the semiconductor element onto the copper circuit plate, thereby reducing the dispersion of the thermal resistance values between the semiconductor element and the ceramic substrate, and reducing or mitigating the thermal stress applied or acting on the mounting portion of the semiconductor element.
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