发明授权
- 专利标题： Automated wafer lapping system
- 专利标题（中）： 自动晶圆研磨系统
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申请号： US653666申请日： 1996-05-31
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公开(公告)号： US5679055A公开(公告)日： 1997-10-21
- 发明人: George W. Greene , Peter D. Albrecht , Kenneth D. Strittmatter , Rafael Hidalgo
- 申请人： George W. Greene , Peter D. Albrecht , Kenneth D. Strittmatter , Rafael Hidalgo
- 申请人地址： MO St. Peters
- 专利权人： MEMC Electronic Materials, Inc.
- 当前专利权人： MEMC Electronic Materials, Inc.
- 当前专利权人地址： MO St. Peters
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; B24B37/08 ; B24B37/34 ; B24B47/22 ; B24B49/04 ; H01L21/304 ; B24B37/02
摘要：
An automated wafer lapping system including a robot which loads wafers from a cassette into a wafer carrier on a lapping machine one at a time and one after another. The robot is capable of delivering lapped wafers to a thickness gauging device for measuring the wafer thickness and recalibrating the lapping machine between each run. Openings in the wafer carriers for receiving wafers are sized closely to the wafer for minimal relative motion between the wafer and carrier. A centering jig and search program for the robot facilitate fast location of the wafers in the openings. The lapping system also inspects wafers for defects and sorts them accordingly after lapping.
公开/授权文献
- US4019222A Poultry eviscerating method and apparatus 公开/授权日：1977-04-26
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