发明授权
US5683822A Liquid-phase diffusion bonding alloy foils for joining heat-resistant
metals in oxidizing atmospheres
失效
用于在氧化性气氛中接合耐热金属的液相扩散接合合金箔
- 专利标题: Liquid-phase diffusion bonding alloy foils for joining heat-resistant metals in oxidizing atmospheres
- 专利标题(中): 用于在氧化性气氛中接合耐热金属的液相扩散接合合金箔
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申请号: US716183申请日: 1996-09-27
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公开(公告)号: US5683822A公开(公告)日: 1997-11-04
- 发明人: Yasushi Hasegawa , Hisashi Naoi , Yuuichi Satoh , Hiroshi Ukeba
- 申请人: Yasushi Hasegawa , Hisashi Naoi , Yuuichi Satoh , Hiroshi Ukeba
- 申请人地址: JPX Tokyo
- 专利权人: Nippon Steel Corporation
- 当前专利权人: Nippon Steel Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX6-068807 19940406
- 主分类号: B23K20/00
- IPC分类号: B23K20/00 ; B23K20/02 ; B23K20/16 ; B23K35/00 ; B23K35/14 ; B23K35/30 ; C22C19/05 ; C22C30/00
摘要:
Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, plus 0.005 to 1.0 percent carbon, and/or either or both of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, with the balance comprising nickel and impurities, and have a thickness of 3.0 to 300 .mu.m. Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere are also available with substantially vitreous structures.
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