发明授权
- 专利标题: Manufacturing method of CMOS transistor
- 专利标题(中): CMOS晶体管的制造方法
-
申请号: US723710申请日: 1996-09-30
-
公开(公告)号: US5686340A公开(公告)日: 1997-11-11
- 发明人: Mizuki Segawa , Yoshiaki Kato , Hiroaki Nakaoka , Takashi Nakabayashi , Atsushi Hori , Hiroshi Masuda , Ichiro Matsuo , Akihira Shinohara , Takashi Uehara , Mitsuo Yasuhira
- 申请人: Mizuki Segawa , Yoshiaki Kato , Hiroaki Nakaoka , Takashi Nakabayashi , Atsushi Hori , Hiroshi Masuda , Ichiro Matsuo , Akihira Shinohara , Takashi Uehara , Mitsuo Yasuhira
- 申请人地址: JPX Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238 ; H01L21/265
摘要:
Gate electrodes of an N-channel transistor and a P-channel transistor are formed on a semiconductor substrate with a gate insulator therebetween. After conducting a first thermal treatment to the gate electrodes, N-type heavily doped diffusion layers to be a source or a drain of the N-channel transistor are formed using the gate electrode of the N-channel transistor as a mask. After conducting a second thermal treatment to the N-type heavily doped diffusion layers at a lower temperature than that of the first thermal treatment. P-type heavily doped diffusion layers to be a source or a drain of the P-channel transistor are formed using the gate electrode of the P-channel transistor as a mask. Then, a third thermal treatment is conducted to the P-type heavily doped diffusion layers at a lower temperature than that of the second thermal treatment.
公开/授权文献
- US4058334A Self-locking devices 公开/授权日:1977-11-15
信息查询
IPC分类: