发明授权
- 专利标题： Method of forming bond pad structure for the via plug process
- 专利标题（中）： 形成接头焊接结构的方法
-
申请号： US703918申请日： 1996-08-22
-
公开(公告)号： US5700735A公开(公告)日： 1997-12-23
- 发明人: Ruey-Yun Shiue , Wen-Teng Wu , Pi-Chen Shieh , Chin-Kai Liu
- 申请人： Ruey-Yun Shiue , Wen-Teng Wu , Pi-Chen Shieh , Chin-Kai Liu
- 申请人地址： TWX Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TWX Hsin-Chu
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L21/60
摘要：
A bond pad structure and method of forming the bond pad structure which provides for reliable interconnections between the bond pad structure and the next level of circuit integration. The bond pad structure uses three metal pads separated by layers of dielectric. Via plugs are formed between the first and second metal pads and between the second and third metal pads. The via plugs are formed in a diamond shape with respect to the metal pads. The metal pads are squares with the same orientation. The periphery of the via plugs forms a square rotated 45.degree. with respect to the square metal pads.
公开/授权文献
信息查询
IPC分类:
