发明授权
US5703195A Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives 失效
用于微电子粘合剂的亚烷基或亚烷氧基链的聚缩水甘油基苯基醚

Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in
microelectronics adhesives
摘要:
This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities. The flexible epoxy resins are used in adhesives for microelectronic applications.
公开/授权文献
信息查询
0/0