A compliant microelectronic mounting device. An area array of conductive contact pads are connected into rows by conductive leads on a first side of a flexible substrate. Each of the conductive leads bridges a bonding hole in the substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A plurality of compliant dielectric buttons, typically composed of an elastomer material, are attached to a second side of the substrate and typically positioned under each contact pad. The component may be attached to a microelectronic device having contacts so that a stand-off is created between the substrate and the device by the compliant dielectric buttons. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with opposed contact pads on the microelectronic device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the dielectric pads and is then cured.