公开(公告)号：US09824375B2

公开(公告)日：2017-11-21

申请号：US13572137

申请日：2012-08-10

申请人： Patrick J. Allin ,  Charles C. Cherry ,  William H. Eichhorn ,  John W. Smith

发明人： Patrick J. Allin ,  Charles C. Cherry ,  William H. Eichhorn ,  John W. Smith

IPC分类号： G06Q30/04 ,  G06Q10/06 ,  G06Q40/02

CPC分类号： G06Q30/04 ,  G06Q10/06 ,  G06Q40/02

摘要： Systems and methods for managing payments. An invoice is generated based on a first invoice detail from a first participant and the generated invoice is displayed to a second participant. The system receives a modification of the first invoice detail from the second participant along with a comment associated with the modification. The first invoice detail, the modification, and the comment are stored to the computer readable memory and a payment between the participants is facilitated based at least in part on the modification.

公开(公告)号：USD582971S1

公开(公告)日：2008-12-16

申请号：US29263577

申请日：2006-07-26

申请人： John W. Smith ,  Mike Nuttall ,  John Lai ,  Matthias Wieser

设计人： John W. Smith ,  Mike Nuttall ,  John Lai ,  Matthias Wieser

公开(公告)号：US07098074B2

公开(公告)日：2006-08-29

申请号：US10699328

申请日：2003-10-31

申请人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

发明人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

摘要： A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

摘要翻译： 公开了一种制造微电子封装的方法。 将材料施加到微电子元件的第一主表面以减小从第一主表面突出的突起的高度。 微电子元件组装到微电子元件上。 还公开了一种形成突起的方法和包括具有突起的微电子元件的组件。

公开(公告)号：US06965158B2

公开(公告)日：2005-11-15

申请号：US10167169

申请日：2002-06-11

申请人： John W. Smith ,  Belgacem Haba

发明人： John W. Smith ,  Belgacem Haba

IPC分类号： H01L21/44 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/462 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0289 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/4614 ,  H05K2201/0397 ,  H05K2203/1327 ,  H01L2224/0401

摘要： Multi-layer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and can be selectively connected to provide customization of the structure.

摘要翻译： 诸如电路板的多层部件通过使用引线延伸穿过中间介电层来连接导电特征（诸如迹线一个两个或更多个叠置的基板）来制造。 引线可以紧密间隔以提供高密度垂直互连，并且可以选择性地连接以提供结构的定制。

公开(公告)号：US06938338B2

公开(公告)日：2005-09-06

申请号：US10417746

申请日：2003-04-17

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。

公开(公告)号：US06707149B2

公开(公告)日：2004-03-16

申请号：US09968199

申请日：2001-10-01

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L2348

CPC分类号： H01L24/73 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49112 ,  H01L2224/73227 ,  H01L2224/73267 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19107 ,  Y10T29/49121 ,  H01L2224/82 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a compliant microelectronic package includes providing a first substrate having a top surface with conductive pads and an opening extending therethrough to the first substrate so that a bottom surface of the second substrate confronts a top surface of the first substrate. A microelectronic element is attached to the first substrate so that a back face of the microelectronic element confronts the top surface of the first substrate. The contacts of the microelectronic element are electrically interconnected with the conductive pads of the second substrate. A dielectric sheet having conductive leads is juxtaposed with the first substrate. The second ends of the leads are electrically interconnected with the conductive pads of the second substrate, and the dielectric sheet and the second substrate are moved away from one another so as to vertically extend the leads.

摘要翻译： 一种制造柔性微电子封装的方法包括提供具有顶表面的第一衬底和导电焊盘以及穿过其延伸到第一衬底的开口，使得第二衬底的底表面面对第一衬底的顶表面。 微电子元件附接到第一基板，使得微电子元件的背面面对第一基板的顶表面。 微电子元件的触点与第二衬底的导电焊盘电互连。 具有导电引线的电介质片与第一衬底并置。 引线的第二端与第二基板的导电焊盘电互连，并且电介质片和第二基片彼此远离，以使引线垂直延伸。

公开(公告)号：USD485096S1

公开(公告)日：2004-01-13

申请号：US29182098

申请日：2003-05-20

申请人： Thomas Overthun ,  James N. Ludwig ,  David M. Gresham ,  Karl Heinz Mueller ,  Monika Conway ,  Stephen Don Wahl ,  John W. Smith

设计人： Thomas Overthun ,  James N. Ludwig ,  David M. Gresham ,  Karl Heinz Mueller ,  Monika Conway ,  Stephen Don Wahl ,  John W. Smith

公开(公告)号：US06635553B1

公开(公告)日：2003-10-21

申请号：US09721048

申请日：2000-11-22

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L2130

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2224/48

摘要： A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

摘要翻译： 微电子连接部件包括诸如具有沿着表面延伸的细长引线的电介质片的支撑件。 引线具有永久地连接到支撑件的端部端部和可释放地连接到支撑件的尖端端部。 支撑件与诸如半导体芯片或晶片的另外的元件并置，并且引线的尖端使用通过支撑件中的孔前进的焊接工具结合到晶片上的触点。 在粘合之后，支撑件和另外的元件彼此远离，以使引线变形。

公开(公告)号：US06586955B2

公开(公告)日：2003-07-01

申请号：US09793791

申请日：2001-02-27

申请人： Joseph Fjelstad ,  John W. Smith

发明人： Joseph Fjelstad ,  John W. Smith

IPC分类号： G01R3102

CPC分类号： G01R1/07314 ,  G01R1/06744 ,  G01R3/00

摘要： A probe card for testing electronic elements includes a layer of dielectric material provided with a plurality of cavities supported on a substrate. A mass of fusible conductive material having a melting temperature below about 150° C. is disposed in each of said cavities, the dielectric material electrically insulating the masses of fusible conductive material from one another. A probe tip of conductive material having a melting temperature greater than about 150° C. is provided at one common end of each of the masses of fusible conductive material. The probe contacts are separated from an adjacent probe contact by at least one channel formed with the layer of dielectric material.

公开(公告)号：US06441488B1

公开(公告)日：2002-08-27

申请号：US09627111

申请日：2000-07-27

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L2334

CPC分类号： H01L23/49827 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/112 ,  H05K1/141 ,  H05K3/0058 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/00

摘要： A translator for connecting package terminals of a semiconductor chip package to connection pads on a substrate is disclosed. The package terminals are arranged in an array on the semiconductor chip package and the connection pads are arranged in an array on the substrate. The package terminals have a first pitch and the connection pads have a second pitch. The translator has a sheet-like support element with central region and a peripheral region which is more rigid than the central region. First translator terminals are exposed at a first surface of the support element, in the central region. Second translator terminals are exposed at a second surface of the support element, in the peripheral region. The first translator terminals have the first pitch so as to correspond to the package terminals and the second translator terminals have the second pitch so as to correspond to the connection pads. The first and second pitch are different. Traces are provided on the support element and are adapted to connect the package terminals to the first translator terminals.

摘要翻译： 公开了一种用于将半导体芯片封装的封装端子连接到衬底上的连接焊盘的转换器。 封装端子以阵列布置在半导体芯片封装上，并且连接焊盘以阵列布置在衬底上。 封装端子具有第一间距，并且连接焊盘具有第二间距。 平移器具有中央区域和比中心区域更刚性的周边区域的片状支撑元件。 第一翻译终端在中心区域的第一表面露出在支撑元件的第一表面上。 第二转换器端子在外围区域中在支撑元件的第二表面处露出。 第一转换器端子具有与封装端子对应的第一间距，并且第二转换器端子具有与连接焊盘对应的第二间距。 第一和第二音调是不同的。 轨迹设置在支撑元件上，并且适于将包装端子连接到第一转换器端子。