发明授权
- 专利标题： Method for producing thin film multilayer wiring board
- 专利标题（中）： 薄膜多层布线板的制造方法
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申请号： US494974申请日： 1995-06-26
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公开(公告)号： US5707749A公开(公告)日： 1998-01-13
- 发明人: Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
- 申请人： Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-329064 19901130
- 主分类号： B32B15/08
- IPC分类号： B32B15/08 ; H05K3/00 ; H05K3/38 ; H05K3/46 ; B32B7/12 ; B32B27/00
摘要：
A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
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