Invention Grant
- Patent Title: Chip fuse
- Patent Title (中): 芯片保险丝
-
Application No.: US459770Application Date: 1995-06-02
-
Publication No.: US5726620APublication Date: 1998-03-10
- Inventor: Hiroo Arikawa
- Applicant: Hiroo Arikawa
- Applicant Address: JPX Tokyo
- Assignee: SOC Corporation
- Current Assignee: SOC Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX5-167245 19930601
- Main IPC: H01H85/00
- IPC: H01H85/00 ; H01H85/02 ; H01H85/041 ; H01H85/045 ; H01H85/143 ; H01H85/157 ; H01H85/165 ; H01H85/175
Abstract:
A chip fuse is disclosed which includes a hollow insulating body and a fusible element extending through the body the respective ends thereof being engaged with end portions of the body. Two terminals are fitted onto the end portions of the body. Each terminal includes a projection for fixing the terminal to the end portion of the body. The body may include two grooves into which respective projections are fitted.
Public/Granted literature
- US4510663A Method of installing multi-sections vertically acting doors Public/Granted day:1985-04-16
Information query
