- 专利标题： Tape under frame for conventional-type IC package assembly
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申请号： US618359申请日： 1996-03-19
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公开(公告)号： US5729049A公开(公告)日： 1998-03-17
- 发明人: David J. Corisis , Larry D. Kinsman , Jerry M. Brooks
- 申请人： David J. Corisis , Larry D. Kinsman , Jerry M. Brooks
- 申请人地址： ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： ID Boise
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/48 ; H01L23/12 ; H01L23/50
摘要：
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.
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