Invention Grant
US5730847A Arc ion plating device and arc ion plating system 失效
电弧离子镀装置及电弧离子镀系统

Arc ion plating device and arc ion plating system
Abstract:
The present invention relates to an arc ion plating device utilizing a vacuum arc discharge to be utilized for the surface process of works and to an arc ion plating system provided with the above-mentioned device, and the present invention offers the device and the system which are able to realize extremely high productivity by an efficient handling of works. The device according to the present invention comprises a rod-shaped evaporation source and works to be coated with a film being disposed so as to surround the rod-shaped evaporation source, The device is so constituted that the works can be moved relative to the rod-shaped evaporation source in the axial direction of the rod-shaped evaporation source.
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