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    High pressure processing apparatus and method
    4.
    发明授权
    High pressure processing apparatus and method 失效
    高压加工设备及方法

    公开(公告)号：US07111630B2

    公开(公告)日：2006-09-26

    申请号：US10879318

    申请日：2004-06-28

    Applicant: Ikuo Mizobata ,  Yusuke Muraoka ,  Kimitsugu Saito ,  Ryuji Kitakado ,  Yoichi Inoue ,  Yoshihiko Sakashita ,  Katsumi Watanabe ,  Masahiro Yamagata ,  Hisanori Oshiba

    Inventor： Ikuo Mizobata ,  Yusuke Muraoka ,  Kimitsugu Saito ,  Ryuji Kitakado ,  Yoichi Inoue ,  Yoshihiko Sakashita ,  Katsumi Watanabe ,  Masahiro Yamagata ,  Hisanori Oshiba

    IPC: B08B3/04

    CPC classification number: B08B9/0321 ,  B08B7/0021 ,  Y10S134/902

    Abstract: When the hatch of a substrate washing chamber 5 is opened to receive a substrate, certain valves are closed, and a valve is opened, supply CO2 to purge the substrate washing chamber 5 to and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamber 5 so that the CO2 expels any gas and unwanted air from the substrate washing chamber 5 and the conduits. Thereafter, super critical CO2 is used to wash the substrate and clean the circulation line. The flow of supercritical CO2 is sent to the substrate washing chamber 5. After flowing through the circulation line, including a circulation channel 11, it passes through a bypass channel 12 to a decompressor 7. Any chemicals or organic substances left in the circulation line are continuously sent to a separation/recover bath 8 together with the flow.

    Abstract translation: 当基板清洗室5的开口被打开以接收基板时，某些阀关闭，并且阀打开，供应CO 2以清洗基板清洗室5并排除空气。 当舱口关闭时，打开另一个阀以排放基板清洗室5，使得CO 2从基板清洗室5和导管排出任何气体和不需要的空气。 此后，使用超临界CO 2 2来洗涤基底并清洁循环线。 超临界CO 2 2的流动被送到衬底洗涤室5。 在流过包括循环通道11的循环管线之后，它通过旁路通道12到达减压器7。 残留在循环管线中的任何化学物质或有机物质与流体一起被连续地送到分离/回收槽8中。

    High-pressure processing apparatus and high-pressure processing method
    6.
    发明申请
    High-pressure processing apparatus and high-pressure processing method 失效
    高压加工设备及高压加工方法

    公开(公告)号：US20050079107A1

    公开(公告)日：2005-04-14

    申请号：US10958224

    申请日：2004-10-04

    Applicant: Yusuke Muraoka ,  Tomomi Iwata ,  Kimitsugu Saito ,  Masahiro Yamagata ,  Yoichi Inoue ,  Hisanori Oshiba

    Inventor： Yusuke Muraoka ,  Tomomi Iwata ,  Kimitsugu Saito ,  Masahiro Yamagata ,  Yoichi Inoue ,  Hisanori Oshiba

    IPC: B08B3/08 ,  G05D11/13 ,  H01L21/304 ,  H01L21/306 ,  G05D9/00 ,  G05B1/00

    CPC classification number: G05D11/132 ,  Y10S134/902

    Abstract: Mixing baths 6A and 6B which temporarily hold chemical agents A and B respectively are disposed. The mixing baths 6A and 6B are each connected with a high-pressure fluid supplying unit 2. For surface treatment using a mixture of the chemical agent A and SCF (processing fluid), SCF is fed under pressure from the high-pressure fluid supplying unit 2 to the mixing bath 6A which already holds the chemical agent A, whereby the chemical agent A dissolves in SCF flowing into the mixing bath 6A and the mixture of the chemical agent A and SCF (processing fluid) is created. As a high-pressure valve (processing fluid introducing valve) 39 is opened, the processing fluid is sent into a pressure vessel 1. This achieves a predetermined surface treatment of a substrate which has been set inside the pressure vessel 1, using the processing fluid.

    Abstract translation: 分别临时容纳化学试剂A和B的混合浴6A和6B。 混合槽6A和6B各自与高压流体供应单元2连接。为了使用化学试剂A和SCF（处理流体）的混合物的表面处理，SCF在压力下从高压流体供应单元 2到已经保持化学试剂A的混合槽6A，由此化学试剂A溶解在流入混合槽6A的SCF中，并且产生化学试剂A和SCF（加工流体）的混合物。 当打开高压阀（加工流体导入阀）39时，处理流体被送入压力容器1中。这样就可以利用处理流体对设置在压力容器1内部的基板进行预定的表面处理 。

    High pressure processing apparatus
    7.
    发明授权
    High pressure processing apparatus 失效
    高压加工设备

    公开(公告)号：US06874513B2

    公开(公告)日：2005-04-05

    申请号：US10123252

    申请日：2002-04-17

    Applicant: Masahiro Yamagata ,  Hisanori Oshiba ,  Yoshihiko Sakashita ,  Yoichi Inoue ,  Yusuke Muraoka ,  Kimitsugu Saito ,  Ikuo Mizobata ,  Ryuji Kitakado

    Inventor： Masahiro Yamagata ,  Hisanori Oshiba ,  Yoshihiko Sakashita ,  Yoichi Inoue ,  Yusuke Muraoka ,  Kimitsugu Saito ,  Ikuo Mizobata ,  Ryuji Kitakado

    IPC: H01L21/302 ,  B08B3/02 ,  B08B7/00

    CPC classification number: B08B7/0021 ,  B08B3/02 ,  Y10S134/902

    Abstract: A high-pressure processing apparatus for removing unnecessary matters on objects to be processed by bringing a high-pressure fluid and a chemical liquid other than the high-pressure fluid into contact with the objects to be processed in a pressurized state is provided with a plurality of high-pressure processing chambers, a common high-pressure fluid supply unit for supplying the high-pressure fluid to each one of the high-pressure processing chambers, a common chemical liquid supply unit for supplying the chemical liquid to the each high-pressure processing chambers, and a separating unit for separating gaseous components from a mixture of the high-pressure fluid and the chemical liquid discharged from the high-pressure processing chambers after the objects are processed.Thus, a high-pressure processing apparatus which has such a compact construction as to be partly installable in a clean room and can stably perform a high-pressure processing can be provided.

    Abstract translation: 通过使高压流体和高压流体以外的化学液体与加压状态下的被处理物体接触来除去被加工物上的不必要物质的高压处理装置，具有多个 的高压处理室，用于将高压流体供给到每个高压处理室的普通高压流体供给单元，用于向每个高压处理室供给化学液体的公共化学液体供给单元 处理室，以及分离单元，用于在物体被处理之后从高压流体和从高压处理室排出的化学液体的混合物中分离出气态成分。因此，具有这样的高压处理装置 可以提供可部分安装在洁净室中并可稳定地进行高压处理的紧凑结构。

    Cleaning apparatus for cleaning objects to be treated with use of cleaning composition
    8.
    发明申请
    Cleaning apparatus for cleaning objects to be treated with use of cleaning composition 审中-公开
    使用清洁剂清洁待处理物体的清洁装置

    公开(公告)号：US20050005957A1

    公开(公告)日：2005-01-13

    申请号：US10886629

    申请日：2004-07-09

    Applicant: Masahiro Yamagata ,  Hisanori Oshiba ,  Yoichi Inoue ,  Yusuke Muraoka ,  Tomomi Iwata ,  Kimitsugu Saito

    Inventor： Masahiro Yamagata ,  Hisanori Oshiba ,  Yoichi Inoue ,  Yusuke Muraoka ,  Tomomi Iwata ,  Kimitsugu Saito

    IPC: B08B3/08 ,  B08B7/00 ,  H01L21/00 ,  H01L21/027 ,  H01L21/304 ,  B08B3/00

    CPC classification number: H01L21/67051 ,  B08B7/0021

    Abstract: Provided is a cleaning apparatus for cleaning an object to be treated by contacting the object to be treated with a high pressure fluid of a cleaning composition containing a cleaning component as an essential ingredient. The cleaning apparatus includes high pressure fluid supplying means for supplying the high pressure fluid of the cleaning composition, a high pressure washing vessel for removing unnecessary materials deposited on the object to be treated by contacting the object to be treated with the high pressure fluid of the cleaning composition therein, a storing vessel for storing a waste high pressure fluid of the cleaning composition carrying the unnecessary materials therein, and a sealed structure for sealably housing the high pressure fluid supplying means, the high pressure washing vessel, and the storing vessel therein. The sealed structure has first exhaust means for exhausting the gas remaining in the sealed structure therefrom.

    Abstract translation: 本发明提供一种清洁装置，用于通过将含有清洁组分作为必要成分的清洁组合物的高压流体接触待处理物体来清洁待处理物体。 清洁装置包括用于供应清洁组合物的高压流体的高压流体供应装置，用于通过使待处理物体与待处理物体接触的待处理物体与所述待处理物体接触的高压流体来除去沉积在待处理物体上的不需要的材料的高压清洗容器 清洁组合物，用于储存载有不需要的材料的清洁组合物的废高压流体的储存容器，以及用于将高压流体供给装置，高压清洗容器和储存容器密封地容纳在其中的密封结构。 密封结构具有用于从其中排出残留在密封结构中的气体的第一排气装置。

    High-temperature and high-pressure treatment device
    9.
    发明授权
    High-temperature and high-pressure treatment device 失效
    高温高压处理装置

    公开(公告)号：US06733592B2

    公开(公告)日：2004-05-11

    申请号：US10142990

    申请日：2002-05-13

    Applicant: Takao Fujikawa ,  Yoichi Inoue ,  Yutaka Narukawa ,  Takahiko Ishii ,  Tsuneharu Masuda ,  Makoto Kadoguchi ,  Yoshihiko Sakashita

    Inventor： Takao Fujikawa ,  Yoichi Inoue ,  Yutaka Narukawa ,  Takahiko Ishii ,  Tsuneharu Masuda ,  Makoto Kadoguchi ,  Yoshihiko Sakashita

    IPC: C23C1600

    CPC classification number: C30B33/005 ,  H01L21/67109 ,  Y10S414/135

    Abstract: The present invention has an object to obtain a small-size, high-temperature and high-pressure treatment device adapted to treat semiconductor wafers. The high-temperature and high-pressure device of the invention is intended to treat semiconductor wafers in an atmosphere of high-temperature and high-pressure gas, and comprises a pressure vessel having at a lower portion thereof an opening for putting the semiconductor wafers in and out, a lower lid disposed so as to be vertically movable for opening and closing the lower opening, wafer transfer means for stacking and unstacking the semiconductor wafers onto and from the lower lid, and a heater attached to the lower lid for heating the semiconductor wafers.

    Abstract translation: 本发明的目的是获得适于处理半导体晶片的小尺寸，高温和高压处理装置。 本发明的高温高压装置旨在在高温高压气体的气氛中处理半导体晶片，并且包括在其下部具有用于将半导体晶片放置在其中的开口的压力容器 并且，设置成能够垂直移动以便打开和关闭下部开口的下盖，用于将半导体晶片堆叠和分离到下盖上的晶片传送装置和附接到下盖的加热半导体的加热器 晶圆

    Method of integrally molding member onto portion of rigid member
    10.
    发明授权
    Method of integrally molding member onto portion of rigid member 失效
    将构件整体模制到刚性构件的部分上的方法

    公开(公告)号：US4865794A

    公开(公告)日：1989-09-12

    申请号：US180227

    申请日：1988-04-11

    Applicant: Yasuyoshi Nakajima ,  Takao Umezawa ,  Takashi Momiyama ,  Yoichi Inoue

    Inventor： Yasuyoshi Nakajima ,  Takao Umezawa ,  Takashi Momiyama ,  Yoichi Inoue

    IPC: B29C45/14

    CPC classification number: B29C45/14065 ,  B29C45/14

    Abstract: A method of integrally molding a member to be molded onto a portion of a rigid member, which method is applied to manufacture of a connecting rod used in a crank device of a wiper system in a motor vehicle, for example. In this method of molding, a portion to be positioned is formed in the rigid member, a portion of the rigid member is inserted into a cavity for molding the member to be molded in such a manner that the portion to be positioned is exposed in the cavity, positioning members linearly movably provided in this cavity are engaged with this portion to be positioned to effect positioning, the positioning members are retracted to the outside of the portion to be positioned after the positioning, and thereafter, a molding material is poured into the cavity to mold the member to be molded. The rigid member has a mounting hole integrally molded therein with the resinous member to be molded, slits are provided on the inner peripheral surface of the member to be molded, and the mounting hole formed such that the inner diameters of portions of the mounting hole as opposed to said slits are decreased.

    Abstract translation: 一种将待模制的构件整体模制在刚性构件的一部分上的方法，该方法用于制造例如用在机动车辆中的擦拭器系统的曲柄装置中的连杆。 在这种成型方法中，将待定位的部分形成在刚性构件中，刚性构件的一部分被插入到用于模制待模制构件的空腔中，使得待定位的部分暴露在 空腔，可直线移动地设置在该空腔中的定位构件与该部分接合以被定位以实现定位，定位构件在定位之后缩回到要定位的部分的外侧，然后将成型材料倒入 空腔以模制待模制的构件。 刚性构件具有与模制的树脂构件一体地模制的安装孔，在待模制构件的内周面上设置狭缝，并且安装孔形成为使得安装孔的部分的内径为 与所述狭缝相对的面积减小。

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