发明授权
- 专利标题： Semiconductor device with increased on chip decoupling capacitance
- 专利标题（中）： 半导体器件具有增加的片上去耦电容
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申请号： US732095申请日： 1996-10-15
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公开(公告)号： US5739045A公开(公告)日： 1998-04-14
- 发明人: John Edward Cronin , John Andrew Hiltebeitel
- 申请人： John Edward Cronin , John Andrew Hiltebeitel
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L27/04
- IPC分类号： H01L27/04 ; H01L21/822 ; H01L23/522 ; H01L23/528 ; H05K1/16 ; H01L21/70
摘要：
A semiconductor device has an on-board decoupling capacitor provided at its interconnect region. The decoupling capacitor comprises two layers of metallurgy separated by a dielectric layer wherein two of the layers are identically patterned.
公开/授权文献
- US5120186A Crane attachment for loading machines 公开/授权日：1992-06-09
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