A method for forming interconnections for semiconductor fabrication and semiconductor devices have such interconnections are described. A first patterned dielectric layer is formed over a semiconductor substrate and has a first opening filed with conductive material. Another patterned dielectric layer is formed over the first dielectric layer and has a second opening over at least a portion of the conductive material. The first patterned dielectric layer may serve as an etch-stop in patterning the other patterned dielectric layer. Also, a dielectric etch-stop layer may be formed over the first patterned dielectric layer and over the conductive material before the other patterned dielectric layer has been formed. This dielectric etch-stop layer may serve as an etch-stop in patterning the other patterned dielectric layer. The second opening exposes a portion of the dielectric etch-stop layer. The exposed portion of the dielectric etch-stop layer is removed. The second opening is filled with conductive material.