发明授权
- 专利标题： Semiconductor device and semiconductor module
- 专利标题（中）： 半导体器件和半导体模块
-
申请号： US680614申请日： 1996-07-16
-
公开(公告)号： US5747876A公开(公告)日： 1998-05-05
- 发明人: Gourab Majumdar , Satoshi Mori , Sukehisa Noda , Tooru Iwagami , Yoshio Takagi , Hisashi Kawafuji
- 申请人： Gourab Majumdar , Satoshi Mori , Sukehisa Noda , Tooru Iwagami , Yoshio Takagi , Hisashi Kawafuji
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-312559 19951130
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L23/24 ; H01L23/36 ; H01L23/433 ; H01L23/495 ; H01L25/07 ; H01L25/16 ; H01L25/18 ; H05K1/02 ; H01L23/22
摘要：
It is an object to facilitate assembly of an application device. A device (101) is provided with a heat sink (51) to radiate loss heat of an IGBT element (11) as a power semiconductor element to an external radiation fin. External terminals (5 and 6) connected to an external circuit substrate protrude in the direction in which the exposed surface of the heat sink (51) is directed. Accordingly, when assembling an application device by mounting the device (101) on the external circuit substrate together with other circuit elements, it is possible to mount the device (101) and other circuit elements together on the common main surface of the circuit substrate, i.e., on its main surface on the side opposite to the side where the radiation fin is attached. Accordingly, it is possible to collectively apply solder on the common main surface of the circuit substrate and collectively solder the device (101) and the other circuit elements.
公开/授权文献
- US4622894A Belt press load bearing measuring means 公开/授权日：1986-11-18
信息查询
IPC分类:
