发明授权
- 专利标题: Cooling device of multi-chip module
- 专利标题(中): 多芯片模块冷却装置
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申请号: US571711申请日: 1995-12-13
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公开(公告)号: US5751062A公开(公告)日: 1998-05-12
- 发明人: Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
- 申请人: Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX6-333389 19941215
- 主分类号: H01L23/36
- IPC分类号: H01L23/36 ; H01L23/433 ; H01L23/367
摘要:
A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
公开/授权文献
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