公开(公告)号：US5751062A

公开(公告)日：1998-05-12

申请号：US571711

申请日：1995-12-13

申请人： Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Noriyuki Ashiwake ,  Kenichi Kasai ,  Keizou Kawamura ,  Akio Idei

发明人： Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Noriyuki Ashiwake ,  Kenichi Kasai ,  Keizou Kawamura ,  Akio Idei

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/367

CPC分类号： H01L23/4338 ,  H01L2224/73253

摘要： A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.

摘要翻译： 多芯片模块的冷却装置具有独立于热变形和易于组装和拆卸的微封装。 多芯片模块包括多层基板，其上安装有每个包装LSI芯片的微封装以及与冷却器一体形成的壳体。 每个微封装包括第一导热构件，具有用于容纳LSI芯片的盖部分和与其一体形成的与盖部分相同的材料制成的第一鳍片，以及固定到第一热量帽盖部分的基板 所述LSI芯片被安装在所述基板上，所述基板被牢固地固定到所述导热部件的盖部，同时在其背面牢固地接合到所述第一导热部件的盖部的内表面。 每个包括基部和第二翅片的第二热传导构件设置成与第一翅片接合并且分别通过弹簧压靠在冷却器上。

公开(公告)号：US5774334A

公开(公告)日：1998-06-30

申请号：US520338

申请日：1995-08-28

申请人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

发明人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

IPC分类号： H01L23/433 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

摘要翻译： 半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。 两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。 两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。 作为导热介质的液体封装在半导体模块中。 半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。 此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。 通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

公开(公告)号：US5959351A

公开(公告)日：1999-09-28

申请号：US103227

申请日：1993-08-09

申请人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

发明人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  F15D1/08 ,  H01L23/427 ,  H01L23/473 ,  H01L23/34

CPC分类号： F15D1/08 ,  H01L23/473 ,  F28F13/02 ,  H01L2924/0002

摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

摘要翻译： 公开了一种液冷电子装置。 半导体器件安装在浸没在冷却液中的半导体模块的衬底上。 在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。 通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在 开始半导体器件通电的时间，从而稳定半导体器件的温度。

公开(公告)号：US5406807A

公开(公告)日：1995-04-18

申请号：US77109

申请日：1993-06-16

申请人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

发明人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

IPC分类号： H01L23/427 ,  F25D17/02

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  Y10S165/908

摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

摘要翻译： 一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。 由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

公开(公告)号：US06632780B2

公开(公告)日：2003-10-14

申请号：US09798051

申请日：2001-03-05

申请人： Takao Uematsu ,  Yutaka Ito ,  Takahiro Daikoku ,  Akio Idei ,  Akihiro Yasuda

发明人： Takao Uematsu ,  Yutaka Ito ,  Takahiro Daikoku ,  Akio Idei ,  Akihiro Yasuda

IPC分类号： C10M11308

CPC分类号： C10M169/00 ,  C10M169/06 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2205/0206 ,  C10M2205/0265 ,  C10M2207/0406 ,  C10M2207/2825 ,  C10M2207/2835 ,  C10M2207/289 ,  C10M2209/103 ,  C10M2209/104 ,  C10M2209/108 ,  C10M2209/109 ,  C10M2213/0606 ,  C10N2220/082 ,  C10N2240/201 ,  C10N2240/204 ,  C10N2250/10

摘要： There are provided a highly thermal conductive grease composition having both a thermal conductivity and a satisfactory dispense property, and a cooling device applied with same. The grease composition comprises from 70 to 90% by volume of an inorganic powder which is a mixture containing at least two kinds of inorganic powders different from each other in each average particle size, and from 10 to 30% by volume of a base oil containing a mineral oil or a synthetic oil, the base oil further containing a surfactant in an amount of from 0.2 to 2.0% by weight based on the weight of the inorganic powder.

摘要翻译： 提供了具有导热性和令人满意的分配性能的高导热性润滑脂组合物，以及与此相应的冷却装置。 该润滑脂组合物含有70〜90体积％的无机粉末，该无机粉末是含有平均粒径不同的至少两种无机粉末的混合物，10〜30体积％的含有 矿物油或合成油，基础油还含有基于无机粉末重量的0.2-2.0重量％的表面活性剂。

公开(公告)号：US20120312504A1

公开(公告)日：2012-12-13

申请号：US13494461

申请日：2012-06-12

申请人： Kazuaki Suzuki ,  Shigemasa Sato ,  Akio Idei

发明人： Kazuaki Suzuki ,  Shigemasa Sato ,  Akio Idei

IPC分类号： F28D15/02 ,  F25B49/00

CPC分类号： H05K1/0201 ,  F25B39/04 ,  F28D15/0266 ,  F28D15/046 ,  F28F13/187 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20318 ,  H01L2924/00

摘要： A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

摘要翻译： 沸腾的制冷剂型冷却系统，在发热开始时抑制过冲，实现稳定的沸腾开始。 在沸腾制冷剂型冷却系统中，金属沸腾传热单元具有与发热体热接触的基部。 沸腾传热单元与液体制冷剂接触。 沸腾传热单元具有多个平行的隧道，其与其外表面上的通孔或间隙连通，比通过所有隧道在与隧道正交的方向上形成的隧道直径更深的沟槽以及沟槽上的盖板。

公开(公告)号：US20110155504A1

公开(公告)日：2011-06-30

申请号：US13044133

申请日：2011-03-09

申请人： YOSUKE TANABE ,  Masanori Watanabe ,  Akira Goto ,  Shigeyasu Tsubaki ,  Masahiko Usui ,  Akio Idei

发明人： YOSUKE TANABE ,  Masanori Watanabe ,  Akira Goto ,  Shigeyasu Tsubaki ,  Masahiko Usui ,  Akio Idei

IPC分类号： E04F17/04

CPC分类号： G10K11/172 ,  H05K7/20718

摘要： Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.

摘要翻译： 设置有冷却空气流过的一个或多个流动通道的沉降设备具有形成流路的流路形成部件，以及固定在流路形成部件上的吸声部件。 通过在吸声部件中设置共振型消音器的空腔，在流路形成部件的一部分设置共振型消音器的开口，在流路的壁面上形成共振型消音器。 谐振型消声器基于由风扇产生的噪声的峰值频率来设定需要减小的噪声频率。 消音装置还具有滑动构件，滑动构件通过滑动机构滑动以调节孔的顶部的面积。 能够用空气冷却发热部的电子设备的消音装置结构简单，结构简单，能够通过吹送空气来提高消音效果。

公开(公告)号：US07936560B2

公开(公告)日：2011-05-03

申请号：US12544166

申请日：2009-08-19

申请人： Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

发明人： Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

IPC分类号： H05K7/20

CPC分类号： F28D15/043 ,  F28D15/046 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

摘要翻译： 提供了包括具有高性能CPU的冷却结构的刀片服务器。 为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽， 上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧 将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

公开(公告)号：US20100187037A1

公开(公告)日：2010-07-29

申请号：US12752781

申请日：2010-04-01

申请人： Akira Goto ,  Akio Idei ,  Shigeyasu Tsubaki

发明人： Akira Goto ,  Akio Idei ,  Shigeyasu Tsubaki

IPC分类号： F01N13/00 ,  H02K5/24

CPC分类号： F24F13/24 ,  G06F1/182

摘要： In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.

摘要翻译： 为了提供能够在保持电子设备的冷却能力的同时降低电子设备的噪音的吸声结构，提供了一种吸声结构，其中通过布置多个具有预定的 在来自鼓风机的冷却流体的流动通道中以预定间隔形状，并且布置多个声学材料，使得垂直入射在来自鼓风机的穿透开口的穿透平面上的声音不会直接离开电子设备。

公开(公告)号：US20060227515A1

公开(公告)日：2006-10-12

申请号：US11368055

申请日：2006-03-02

申请人： Takafumi Enami ,  Akio Idei ,  Shigemasa Sato ,  Chikakazu Ninomiya

发明人： Takafumi Enami ,  Akio Idei ,  Shigemasa Sato ,  Chikakazu Ninomiya

IPC分类号： H05K7/20

CPC分类号： H01L23/4338 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2224/0401

摘要： A cooling apparatus for cooling a plurality of electronic devices each having a large heating value and a small area, capable of effectively cooling the semiconductor chips with the use of a single cooler, comprises a plurality of thermal conductors mounted on the electronic devices and formed with thermal conductive fins, a housing formed with fins fitted with the fins of the thermal conductors, and a cooling device mounted on the housing, for removing heat from the electronic devices, wherein the housing is formed therein with a plane heat-pipe.

摘要翻译： 一种用于冷却具有大的热值和小面积的多个电子装置的冷却装置，其能够使用单个冷却器有效地冷却半导体芯片，包括安装在电子装置上并形成有多个热导体的多个热导体 导热翅片，形成有装配有热导体的翅片的翅片的壳体，以及安装在壳体上的用于从电子设备移除热量的冷却装置，其中壳体在其中形成有平面热管。