- 专利标题: Advanced damascene planar stack capacitor fabrication method
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申请号: US752137申请日: 1996-11-19
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公开(公告)号: US5753948A公开(公告)日: 1998-05-19
- 发明人: Son Van Nguyen , Matthias Ilg , Kevin J. Uram
- 申请人: Son Van Nguyen , Matthias Ilg , Kevin J. Uram
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: H01L27/04
- IPC分类号: H01L27/04 ; H01L21/02 ; H01L21/822 ; H01L21/8242 ; H01L27/108 ; H01L29/72
摘要:
Capacitor storage charge can be increased by increasing storage node area. A high aspect surface ratio stack capacitor is produced without increasing overall cell dimensions. The node is formed with layers of low doped and high doped concentration borophosphosilicate glass which is deposited by a single process step with precise nanometer dimensions, are selectively etched so that either doped or undoped layers will have a higher etch rate. This etching creates finger-like projections in the node, which provide for greater surface area using a very simplified process requiring fewer processing steps.
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