发明授权
US5757078A Semiconductor device with increased multi-bumps and adhered multilayered
insulating films and method for installing same
失效
具有增加的多凸起和粘附的多层绝缘膜的半导体器件及其安装方法
- 专利标题： Semiconductor device with increased multi-bumps and adhered multilayered insulating films and method for installing same
- 专利标题（中）： 具有增加的多凸起和粘附的多层绝缘膜的半导体器件及其安装方法
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申请号： US637281申请日： 1996-04-24
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公开(公告)号： US5757078A公开(公告)日： 1998-05-26
- 发明人: Shuichi Matsuda , Kazutaka Shoji
- 申请人： Shuichi Matsuda , Kazutaka Shoji
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-103812 19950427
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/12 ; H01L23/485 ; H01L23/498 ; H01L23/48
摘要：
A semiconductor device including a semiconductor chip having electrode pads, a package composed of a plurality of insulating films and adhered to the semiconductor chip by an adhesive agent. The package includes wiring patterns interposed between the plurality of insulating films, and the wiring patterns are selectively connected to the electrode pads at one end, and to the plurality of electrically conductive protrusions at the other end, via viaholes. The semiconductor device further includes a plurality of electrically conductive protrusions extending from the outermost wiring patterns via the viaholes provided in the outermost insulating film.
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