发明授权
- 专利标题: Apparatus for and method for polishing workpiece
- 专利标题(中): 用于抛光工件的设备和方法
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申请号: US807463申请日: 1997-02-27
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公开(公告)号: US5762539A公开(公告)日: 1998-06-09
- 发明人: Masamichi Nakashiba , Norio Kimura , Isamu Watanabe , Kaori Yoshida
- 申请人: Masamichi Nakashiba , Norio Kimura , Isamu Watanabe , Kaori Yoshida
- 申请人地址: JPX Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JPX Tokyo
- 主分类号: B24B37/30
- IPC分类号: B24B37/30 ; B24B49/16 ; B24B5/00
摘要:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.