发明授权
US5767447A Electronic device package enclosed by pliant medium laterally confined
by a plastic rim member
失效
电子器件封装由横向由塑料边缘构件限制的柔性介质包围
- 专利标题： Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
- 专利标题（中）： 电子器件封装由横向由塑料边缘构件限制的柔性介质包围
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申请号： US567659申请日： 1995-12-05
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公开(公告)号： US5767447A公开(公告)日： 1998-06-16
- 发明人: Thomas Dixon Dudderar , Byung Joon Han , Venkataram Reddy Raju , George John Shevchuk
- 申请人： Thomas Dixon Dudderar , Byung Joon Han , Venkataram Reddy Raju , George John Shevchuk
- 申请人地址： Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： Murray Hill
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L23/04 ; H01L23/057 ; H01L23/24 ; H01L23/29 ; H01L23/31 ; H01L23/498 ; H01L23/02
摘要：
The bottom and side surfaces of an electronic device, such as an integrated circuit chip or a multichip assembly, are surrounded by a soft gel medium. The gel medium is laterally confined by a rigid plastic rim that is epoxy-bonded in place along its perimeter. A plate, made of plastic or metal, can be attached to the top surface of the rim, in order to provide a cover for the package.
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