发明授权
- 专利标题： Co-axial motorized wafer lift
- 专利标题（中）： 同轴电动晶片升降
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申请号： US650198申请日： 1996-05-20
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公开(公告)号： US5772773A公开(公告)日： 1998-06-30
- 发明人: Joe Wytman
- 申请人： Joe Wytman
- 申请人地址： CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： CA Santa Clara
- 主分类号： B66F3/08
- IPC分类号： B66F3/08 ; B65G49/07 ; B66F7/14 ; H01L21/00 ; H01L21/677 ; H01L21/687 ; C23C16/00
摘要：
A heating and lifting mechanism for positioning a semiconductor wafer within a processing chamber is provided including a pedestal for supporting the wafer within the process chamber, a drive shaft extending downwardly from a lower region of the pedestal, which has a lead screw at a distal portion thereof, and a drive mechanism, which is coaxial with the drive shaft, for providing linear vertical translation of the shaft and pedestal. The device also includes a CONFLAT.RTM. assembly located between the pedestal and drive shaft. The CONFLAT.RTM. assembly includes upper and lower substantially flat planar plates removably connected to one another. The upper plate is connected to a lower region of the pedestal, and the lower plate is connected to an upper end of the drive shaft. The CONFLAT.RTM. assembly permits removal of the heater pedestal without removing the entire lift assembly.
公开/授权文献
- US4626814A Rapid acting electromagnetic actuator 公开/授权日：1986-12-02
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