公开(公告)号：US5993141A

公开(公告)日：1999-11-30

申请号：US062487

申请日：1998-04-17

申请人： Joe Wytman

发明人： Joe Wytman

IPC分类号： B25J11/00 ,  B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B66C23/00

CPC分类号： H01L21/68707 ,  H01L21/67742 ,  Y10S414/135

摘要： An independent dual-blade robot assembly is provided for use in semiconductor wafer processing. The robot assembly includes a rotatable stage located within a chamber, a linear track mounted on an upper surface of the rotatable stage, and article first and second motorized platens slidably mounted on the linear track and configured for movement along a longitudinal axis of the linear track. Each motorized platen is magnetically driven and carries an end effector which extends from a leading edge. The end effectors of the first and second motorized platens are preferably horizontally coplanar. The linear track may be a single track carrying both motorized platens, or two linear track sections may be provided where each carries a single motorized platen. The two track sections may be pivotally or rotatably connected to the rotatable stage.

摘要翻译： 提供独立的双刀片机器人组件用于半导体晶片处理。 机器人组件包括位于室内的可旋转台，安装在可旋转台的上表面上的线性轨道，以及可滑动地安装在线性轨道上并被配置为沿着线性轨迹的纵向轴线移动的物品第一和第二电动压板 。 每个电动压板都是磁力驱动的，并带有从前缘延伸的末端执行器。 第一和第二电动压板的末端执行器优选地是水平共面的。 线性轨道可以是承载两个电动压板的单个轨道，或者可以设置两个线性轨道部分，其中每个承载单个电动压板。 两个轨道部分可以可枢转地或可旋转地连接到可旋转台。

公开(公告)号：US06254328B1

公开(公告)日：2001-07-03

申请号：US09333358

申请日：1999-06-15

申请人： Joe Wytman

发明人： Joe Wytman

IPC分类号： B65G6500

CPC分类号： H01L21/67748 ,  H01L21/67757 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A dual stage load lock is provided for transfer of semiconductor wafers between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber and a second load lock chamber separated by a dividing ledge which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations. A method for transferring wafers through the load lock is also provided.

摘要翻译： 提供双级负载锁定用于在大气压的环境和诸如晶片处理系统的高真空环境之间传送半导体晶片。 双级负载锁定包括第一负载锁定室和第二负载锁定室，该第一负载锁定室与由负载锁定组件的内壁向内延伸一定距离的分隔壁分隔开。 下加载锁定室选择性地与处理系统的传送室连通，并保持在高真空度。 上部负载锁定室在大气压下选择性地与外部环境连通。 因此，当晶片在负载锁的第一和第二室之间转移时，上部负载锁定室的环境可以在大气压力之间变化，当晶片在负载锁定和外部环境之间传递时，以及高真空度。 负载锁定可以包括可以以各种配置布置的模块化室段。 还提供了通过负载锁转移晶片的方法。

公开(公告)号：US5810549A

公开(公告)日：1998-09-22

申请号：US634101

申请日：1996-04-17

申请人： Joe Wytman

发明人： Joe Wytman

IPC分类号： B25J11/00 ,  B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B65G49/00

CPC分类号： H01L21/68707 ,  H01L21/67742 ,  Y10S414/135

摘要： An independent dual-blade robot assembly is provided for use in semiconductor wafer processing. The robot assembly includes a rotatable stage located within a chamber, a linear track mounted on an upper surface of the rotatable stage, and article first and second motorized platens slidably mounted on the linear track and configured for movement along a longitudinal axis of the linear track. Each motorized platen is magnetically driven and carries an end effector which extends from a leading edge. The end effectors of the first and second motorized platens are preferably horizontally co-planar. The linear track may be a single track carrying both motorized platens, or two linear track sections may be provided where each carries a single motorized platen. The two track sections may be pivotally or rotatably connected to the rotatable stage.

摘要翻译： 提供独立的双刀片机器人组件用于半导体晶片处理。 机器人组件包括位于室内的可旋转台，安装在可旋转台的上表面上的线性轨道，以及可滑动地安装在线性轨道上并被配置为沿着线性轨迹的纵向轴线移动的物品第一和第二电动压板 。 每个电动压板都是磁力驱动的，并带有从前缘延伸的末端执行器。 第一和第二电动压板的末端执行器优选地水平共面。 线性轨道可以是承载两个电动压板的单个轨道，或者可以设置两个线性轨道部分，其中每个承载单个电动压板。 两个轨道部分可以可枢转地或可旋转地连接到可旋转台。

公开(公告)号：US6048154A

公开(公告)日：2000-04-11

申请号：US725275

申请日：1996-10-02

申请人： Joe Wytman

发明人： Joe Wytman

IPC分类号： B65G49/00 ,  B65G49/07 ,  C23C14/56 ,  H01L21/677 ,  B65G65/00

CPC分类号： H01L21/67748 ,  H01L21/67757 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A dual stage load lock is provided for transfer of semiconductor wafers between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber and a second load lock chamber separated by a dividing ledge which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations. A method for transferring wafers through the load lock is also provided.

摘要翻译： 提供双级负载锁定用于在大气压的环境和诸如晶片处理系统的高真空环境之间传送半导体晶片。 双级负载锁定包括第一负载锁定室和第二负载锁定室，该第一负载锁定室与由负载锁定组件的内壁向内延伸一定距离的分隔壁分隔开。 下加载锁定室选择性地与处理系统的传送室连通，并保持在高真空度。 上部负载锁定室在大气压下选择性地与外部环境连通。 因此，当晶片在负载锁的第一和第二室之间转移时，上部负载锁定室的环境可以在大气压力之间变化，当晶片在负载锁定和外部环境之间传递时，以及高真空度。 负载锁定可以包括可以以各种配置布置的模块化室段。 还提供了通过负载锁转移晶片的方法。

公开(公告)号：US5772773A

公开(公告)日：1998-06-30

申请号：US650198

申请日：1996-05-20

申请人： Joe Wytman

发明人： Joe Wytman

IPC分类号： B66F3/08 ,  B65G49/07 ,  B66F7/14 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687 ,  C23C16/00

CPC分类号： H01L21/68742 ,  H01L21/67103 ,  H01L21/68785 ,  H01L21/68792 ,  Y10S414/135

摘要： A heating and lifting mechanism for positioning a semiconductor wafer within a processing chamber is provided including a pedestal for supporting the wafer within the process chamber, a drive shaft extending downwardly from a lower region of the pedestal, which has a lead screw at a distal portion thereof, and a drive mechanism, which is coaxial with the drive shaft, for providing linear vertical translation of the shaft and pedestal. The device also includes a CONFLAT.RTM. assembly located between the pedestal and drive shaft. The CONFLAT.RTM. assembly includes upper and lower substantially flat planar plates removably connected to one another. The upper plate is connected to a lower region of the pedestal, and the lower plate is connected to an upper end of the drive shaft. The CONFLAT.RTM. assembly permits removal of the heater pedestal without removing the entire lift assembly.

摘要翻译： 提供了一种用于将半导体晶片定位在处理室内的加热和提升机构，其包括用于将晶片支撑在处理室内的基座，从基座的下部区域向下延伸的驱动轴，其在远端部分具有导螺杆 以及与驱动轴同轴的驱动机构，用于提供轴和基座的线性垂直平移。 该装置还包括位于基座和驱动轴之间的CONFLAT TM组件。 CONFLAT TM组件包括彼此可拆卸地连接的上下基本平坦的平板。 上板连接到基座的下部区域，下板与驱动轴的上端连接。 CONFLAT TM组件允许拆卸加热器底座，而不需要卸下整个升降组件。

公开(公告)号：US06354791B1

公开(公告)日：2002-03-12

申请号：US08835972

申请日：1997-04-11

申请人： Joe Wytman ,  Ivo Raaijmakers

发明人： Joe Wytman ,  Ivo Raaijmakers

IPC分类号： B25J1500

CPC分类号： H01L21/67748 ,  B25J19/0045 ,  H01L21/6831

摘要： A method and apparatus for transferring a semiconductor wafer in both a theta axis and a z-axis is provided. The apparatus is able to maintain maximum process and wafer throughput while minimizing the footprint of the processing machine by utilizing the concept of “vertical integration” to maximize the use of process slots and minimize the machine foot print. The wafer lift apparatus includes a bipolar electrostatic pick-up for engaging the article at an off-center position near an edge thereof. The electrostatic pick-up is positioned near one end of a transfer arm, the other end of the transfer arm being connected to a drive means for rotating the transfer arm and electrostatic pick-up in the theta axis, or vertically moving the transfer arm and electrostatic pick-up in the z-axis. The electrostatic pick-up is preferably connected to a power source by inductive coupling. According to the method of the present invention, the electrostatic pick-up is positioned beneath the wafer at an off-center position, lifted to contact a lower surface of the wafer, and energized to create an attractive force upon the wafer. The wafer is then lifted and rotated to remove the wafer from the end effector. Finally, the wafer is lifted to a pre/post processing plane located above the processing plane.

摘要翻译： 提供了一种用于在θ轴和z轴上传送半导体晶片的方法和装置。 该装置能够通过利用“垂直整合”的概念来最大化处理槽的使用并使机器脚印最小化，从而保持最大的处理和晶片生产量，同时最小化处理机的占地面积。 晶片提升装置包括用于在靠近其边缘的偏心位置接合物品的双极静电拾取器。 静电拾取器位于传送臂的一端附近，传送臂的另一端连接到驱动装置，用于在θ轴上旋转传送臂和静电拾取器，或垂直移动传送臂和 静电拾取在z轴上。 静电拾取器优选地通过电感耦合连接到电源。 根据本发明的方法，静电拾取器位于晶片的偏心位置下方，被提升以接触晶片的下表面，并被激励以在晶片上产生吸引力。 然后将晶片提升并旋转以从末端执行器移除晶片。 最后，将晶片提升到位于处理平面上方的预处理/后处理平面。