A flow control device for a solder wave apparatus that includes an outlet or nozzle from which molten solder flows in an upward direction to contact the lower surface of a target, such as a circuit board. The flow control device provides a screen and baffle that control the flow pattern of molten solder to the nozzle so as to result in a near-parallel solder wave above the nozzle. The screen includes a pair of spaced-apart parallel panels that are disposed upstream of the nozzle. Each of the panels has apertures through which the molten solder flows before entering the nozzle. The apertures of the panels are offset from each other, such that none of the apertures are coaxial but instead overlap each other when superimposed. The baffle is disposed further upstream of the screen, and includes a number of fins disposed substantially perpendicular to the panels. The fins are arranged such that their lengths become progressively shorter in a direction away from the center of the baffle.