公开(公告)号：US5639954A

公开(公告)日：1997-06-17

申请号：US558123

申请日：1995-11-13

申请人： Robert Arnold Crothers ,  Robert Francis Krakora ,  Robert George Starke ,  Michael Lee Paul

发明人： Robert Arnold Crothers ,  Robert Francis Krakora ,  Robert George Starke ,  Michael Lee Paul

IPC分类号： B23K1/20 ,  B23K3/00

CPC分类号： B23K1/203

摘要： An automatic titration system that periodically and automatically determines the pH level and acid number of a flux solution in a flux reservoir associated with an automatic flux application apparatus. The automatic titration system pulls the flux solution from the flux reservoir of the fluxing machine on a continuous basis to be filtered. Flux to be sampled by the automatic titration system is deposited in a titration chamber where a titration analysis is performed. A known reagent solution is mixed with the flux solution in the titration chamber to determine the pH level and acid number of the sampled flux during the titration operation. Containers of flux solution and thinner solution located in the automatic titration system allow flux and thinner to be dispensed into the flux reservoir depending on the outcome of the titration analysis, so as to maintain the flux in the flux reservoir at the desirable pH level and acid number.

摘要翻译： 一种自动滴定系统，其定期并自动地确定与自动助焊剂施加装置相关联的通量储存器中的助熔剂溶液的pH值和酸值。 自动滴定系统连续吸取助熔剂助焊剂溶液，以进行过滤。 通过自动滴定系统取样的助焊剂沉积在进行滴定分析的滴定室中。 将已知的试剂溶液与滴定室中的助熔剂溶液混合以确定滴定操作期间取样的通量的pH值和酸值。 根据滴定分析的结果，位于自动滴定系统中的助熔剂溶液和稀释溶液的容器允许通量和稀释剂分配到通量储存器中，以便将通量储存器中的通量保持在期望的pH水平和酸 数。

公开(公告)号：US5794837A

公开(公告)日：1998-08-18

申请号：US756128

申请日：1996-11-25

申请人： Steven William Cottingham ,  Frank Clyde Spaulding ,  Maxwell Geoffrey Davies ,  Stanley James Pugh ,  Robert Arnold Crothers

发明人： Steven William Cottingham ,  Frank Clyde Spaulding ,  Maxwell Geoffrey Davies ,  Stanley James Pugh ,  Robert Arnold Crothers

IPC分类号： B23K3/06

CPC分类号： B23K3/0653

摘要： A flow control device for a solder wave apparatus that includes an outlet or nozzle from which molten solder flows in an upward direction to contact the lower surface of a target, such as a circuit board. The flow control device provides a screen and baffle that control the flow pattern of molten solder to the nozzle so as to result in a near-parallel solder wave above the nozzle. The screen includes a pair of spaced-apart parallel panels that are disposed upstream of the nozzle. Each of the panels has apertures through which the molten solder flows before entering the nozzle. The apertures of the panels are offset from each other, such that none of the apertures are coaxial but instead overlap each other when superimposed. The baffle is disposed further upstream of the screen, and includes a number of fins disposed substantially perpendicular to the panels. The fins are arranged such that their lengths become progressively shorter in a direction away from the center of the baffle.

摘要翻译： 一种用于焊波装置的流量控制装置，其包括熔融焊料从其向上流动以接触诸如电路板的靶的下表面的出口或喷嘴。 流量控制装置提供屏幕和挡板，其控制熔融焊料到喷嘴的流动模式，从而在喷嘴上方产生近似平行的焊料波。 屏幕包括设置在喷嘴上游的一对间隔开的平行面板。 每个面板具有孔，熔融焊料在进入喷嘴之前流过该孔。 面板的孔彼此偏移，使得没有孔是同轴的，但是当叠加时彼此重叠。 挡板设置在屏幕的更上游，并且包括大致垂直于面板设置的多个翅片。 翼片被布置成使得它们的长度在远离挡板的中心的方向上逐渐变短。